Semiconductor device low temperature test apparatus using electronic cooling element
View Patent ↗A semiconductor device test apparatus, has: a socket, which connects to a semiconductor device undergoing testing mounted thereon; a test tray, which houses the semiconductor device undergoing testing and which is provided, in a position on which the semiconductor device undergoing testing is mounted, with a first electronic cooling element that absorbs heat via one surface thereof and releases heat via the other surface thereof; and a contact block, which is provided with a second electronic cooling element that makes contact with the top of the semiconductor device undergoing testing in a state in which the semiconductor device undergoing testing is mounted on the socket.
1. A semiconductor device test apparatus, comprising:
a socket, which connects to a semiconductor device undergoing testing that is mounted on the socket; and
a test tray, which houses the semiconductor device undergoing testing and which is provided, in a position on which the semiconductor device undergoing testing is mounted, with a first electronic cooling element that absorbs heat via one surface thereof and releases heat via the other surface thereof,
wherein the semiconductor device undergoing testing is housed in the test tray and the bottom side of the semiconductor device undergoing testing is pre-cooled by the first electronic cooling element; the test tray is mounted on the socket and a test is implemented while cooling a bottom side of the semiconductor device undergoing testing, which is mounted on the socket, by the first electronic cooling element; and, after completion of the test, the semiconductor device undergoing testing is heated by the first electronic cooling element of the test tray.
2. The semiconductor device test apparatus according to claim 1 , further comprising:
a contact block, which causes a second electronic cooling element to make contact with a top side of the semiconductor device undergoing testing in a state in which the semiconductor device undergoing testing is mounted on the socket,
wherein, at the time of implementing the test, the top side of the semiconductor device undergoing testing is cooled by the second electronic cooling element.
3. The semiconductor device test apparatus according to claim 2 , wherein the first and/or second electronic cooling element(s) comprise(s) a heat-absorbing surface and a heat-releasing surface, and the heat-absorbing surface and heat-releasing surface can be switched by switching a current direction therein.
4. The semiconductor device test apparatus according to claim 2 , wherein the first and/or second electronic cooling element(s) is (are) a Peltier element.
5. The semiconductor device test apparatus according to claim 3 , wherein, while the test is being implemented, the surface of the first electronic cooling element which corresponds to the socket assumes a heat-releasing state.
6. The semiconductor device test apparatus according to claim 1 , wherein the test tray comprises housing portions for housing a plurality of semiconductor devices undergoing testing, and the first electronic cooling elements are provided in the housing portions and in the positions in which the semiconductor devices undergoing testing are mounted.
7. The semiconductor device test apparatus according to claim 1 , further comprising a tester unit to which the socket is connected.