Package for mounting semiconductor device
View Patent ↗A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.
1. A package for mounting a semiconductor device having a surface exposed to an atmosphere, wherein:
at least part of the surface exposed to the atmosphere is covered with a covering material having higher thermal emissivity than a material of said exposed surface and being selected from the group consisting of a paint, a tape and a seal, the covering material contacting said at least part of the surface exposed to the atmosphere.
2. The package for mounting the semiconductor device according to claim 1 , wherein:
the covering material covers an entire of the exposed surface.
3. The package for mounting the semiconductor device according to claim 1 , wherein:
the exposed surface is mirror finished.
4. The package for mounting the semiconductor device according to claim 1 , wherein:
the covering material is a paint.
5. A package for mounting a semiconductor device having a surface exposed to an atmosphere, wherein:
at least part of the exposed surface is covered with a covering material,
the covering material is a paint, and
the covering material contacts said at least part of the exposed surface,
when a thermal conductivity of the paint is substantially 0.1, a thickness of the paint is set to be less than 4.5 μm.
6. The package for mounting the semiconductor device according to claim 1 , wherein:
the covering material is a tape.
7. The package for mounting the semiconductor device according to claim 1 , wherein:
the covering material is a seal.
8. The package for mounting the semiconductor device according to claim 1 , wherein:
the package is a tape carrier package.
9. The package for mounting the semiconductor device according to claim 1 , wherein:
the package is a chip size package.
10. A package for mounting a semiconductor device having a surface exposed to an atmosphere, wherein:
at least part of the exposed surface is covered with a covering material, the covering material contacting said at least part of the exposed surface, and
the covering material has a thermal emissivity of 0.8 or more.
11. The package for mounting the semiconductor device according to claim 1 , wherein:
the covering material covers only part of the exposed surface, and
a rest of the exposed surface constitutes a mark portion.