Electronic component and method of manufacturing same
View Patent ↗An electronic component includes an organic interposer ( 160, 460, 560, 660, 760, 860, 960 ), a semiconductor chip ( 220 ) mounted over the organic interposer, copper pads ( 250, 751, 851 ) under the organic interposer, a solder attachment ( 110, 510, 610, 910 ) between certain ones of the copper pads, and solder interconnects ( 120, 420 ) between certain other ones of the copper pads and located around an outer perimeter ( 111, 511, 911 ) of the solder attachment. The solder attachment is placed at locations within the electronic component that experience the greatest stress, which may include, for example, locations adjacent to at least a portion of a perimeter ( 221 ) of the semiconductor chip. In one embodiment, a surface area of the solder attachment is larger than a surface area of each one of the solder interconnects. In the same or another embodiment, the electronic component includes multiple solder attachments.
1. An electronic component comprising:
an organic interposer comprising a first surface, a second surface, and a copper pad at the second surface;
a semiconductor chip mounted over the first surface of the organic interposer;
a solder attachment under the second surface of the organic interposer and under the copper pad; and
solder interconnects under the second surface of the organic interposer and located at least outside a perimeter of the solder attachment,
wherein:
the solder interconnects have a pitch no treater than approximately one millimeter; and
the solder attachment and the copper pad are located adjacent to a perimeter of the semiconductor chip.
2. The electronic component of claim 1 wherein:
the solder attachment has a surface area larger than a surface area of each of the solder interconnects.
3. The electronic component of claim 1 wherein:
the solder interconnects are arranged in multiple rows and comprise at least one hundred solder interconnects.
4. The electronic component of claim 1 wherein:
the solder interconnects are arranged in a single line outside the perimeter of the semiconductor chip and comprise fewer than one hundred solder interconnects.
5. The electronic component of claim 1 wherein:
the solder interconnects are located inside and outside the perimeter of the semiconductor chip.
6. The electronic component of claim 1 wherein:
the solder interconnects are located only outside the perimeter of the semiconductor chip.
7. The electronic component of claim 1 further comprising:
multiple copper pads, including the copper pad, at the second surface of the organic interposer; and
multiple solder attachments, including the solder attachment, at the second surface of the organic interposer,
wherein:
no more than one of the multiple solder attachments is located underneath any one of the multiple copper pads; and
an aggregate perimeter around the multiple copper pads and the multiple solder attachments is adjacent to the perimeter of the semiconductor chip.
8. The electronic component of claim 7 wherein:
the multiple copper pads comprise four copper pads, each one located adjacent to a different corner of the perimeter of the semiconductor chip; and
the multiple solder attachments comprise four solder attachments, each one located adjacent to a different corner of the perimeter of the semiconductor chip.
9. The electronic component of claim 8 wherein:
the multiple solder attachments are symmetric underneath the organic interposer.
10. The electronic component of claim 8 wherein:
the solder interconnects are located only outside the aggregate perimeter of the multiple copper pads and the multiple solder attachments.
11. An electronic component comprising:
an organic interposer comprising a first surface, a second surface, and a copper pad at the second surface;
a semiconductor chip, mounted over the first surface of the organic interposer;
a solder attachment under the second surface of the organic interposer and under the copper pad;
solder interconnects under the second surface of the organic interposer and located at least outside a perimeter of the solder attachment;
multiple copper pads, including the copper pad, at the second surface of the organic interposer; and
multiple solder attachments, including the solder attachment, at the second surface of the organic interposer,
wherein:
the solder attachment and the copper pad are located adjacent to a perimeter of the semiconductor chip;
no more than one of the multiple solder attachments is located underneath any one of the multiple copper pads;
an aggregate perimeter around the multiple copper pads and the multiple solder attachments is adjacent to the perimeter of the semiconductor chip;
the multiple copper pads comprise eight copper pads, each one of the eight copper pads located adjacent to a different corner or a different side of the perimeter of the semiconductor chip; and
the multiple solder attachments comprise eight solder attachments, each one of the eight solder attachments located adjacent to a different corner or a different side of the perimeter of the semiconductor chip.
12. The electronic component of claim 11 wherein:
the multiple solder attachments are symmetric underneath the organic interposer.
13. The electronic component of claim 11 wherein:
the solder interconnects are located inside and outside the aggregate perimeter of the multiple copper pads and the multiple solder attachments.
14. The electronic component of claim 1 further comprising:
multiple copper pads, including the copper pad, at the second surface of the organic interposer;
wherein:
at least one of the multiple copper pads has underneath it more than one of the solder interconnects; and
an aggregate perimeter around the multiple copper pads is adjacent to the perimeter of the semiconductor chip.
15. The electronic component of claim 14 wherein:
the multiple copper pads comprise eight copper pads, each one of the eight copper pads located adjacent to a different corner or a different side of the perimeter of the semiconductor chip.
16. The electronic component of claim 15 wherein:
the multiple copper pads are symmetric underneath the organic interposer.
17. The electronic component of claim 15 wherein:
the solder interconnects are located inside and outside the aggregate perimeter of the multiple copper pads.
18. The electronic component of claim 1 wherein:
the electronic component comprises a single solder attachment consisting of the solder attachment;
an aggregate perimeter around the copper pad and the single solder attachment is adjacent to the perimeter of the semiconductor chip; and
the solder interconnects are located only outside the perimeter of the semiconductor chip.
19. The electronic component of claim 1 wherein:
the electronic component comprises a single solder attachment having an outer perimeter and an inner perimeter; and
the single solder attachment is adjacent to all of the perimeter of the semiconductor chip.
20. The electronic component of claim 19 wherein:
the solder interconnects are located inside the inner perimeter of the single solder attachment and outside the outer perimeter of the single solder attachment.
21. The electronic component of claim 11 wherein:
the solder interconnects have a pitch no greater than approximately one millimeter.