IP Library Granted Patent US 7,118,273
Granted Patent B1
US 7,118,273 · App. 10/411,955 · Granted Oct 10, 2006

System for on-chip temperature measurement in integrated circuits

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Quick Facts
Patent No.
US 7,118,273
App. No.
10/411,955
Granted
Oct 10, 2006
Kind
B1
Abstract

A thermal sensor providing simultaneous measurement of two diodes. A first diode and a second diode are coupled to a first current source and a second current source, respectively. The ratio of the currents provided by the two sources is accurately known. The voltage across each of the two diodes may be coupled to the input of a differential amplifier for determination of temperature. Alternatively, the first diode may be coupled to a first current source by a resistor with a known voltage drop, and the second diode may be coupled to an adjustable second current source. The current in the second diode may be adjusted until the voltage across the second diode is equal to the sum of voltage drop across the first diode and the known voltage drop across the resistor. Under the established conditions, the Diode Equation may be used to calculate a temperature.

Claims (29)

1. A system for measuring a temperature in an integrated circuit comprising:

a first diode coupled to a first current source;

a second diode coupled to a second current source;

a controller coupled to said first and second current sources for controlling a current output of said first current source and a current output of said second controlled current source to maintain a fixed ratio between said current output from said first current source and said current output from said second current source; and

a differential amplifier coupled to said first diode and to said second diode for measuring a difference in voltage between said first diode and said second diode, wherein said difference is related to a current temperature of said integrated circuit.

2. The system of claim 1 , wherein said first diode comprises a first array of diode elements and said second diode comprises a second array of diode elements.

3. The system of claim 2 , wherein said first array of diode elements and said second array of diode elements substantially share a common centroid.

4. The system of claim 2 , wherein said first diode and said second diode occupy a substantially square region on the surface of said integrated circuit.

5. The system of claim 1 wherein said first diode and said second diode occupy a region having at least two axes of symmetry.

6. The system of claim 1 , wherein said first current source comprises a first array of current source elements and said second current source comprises a second array of current source elements and wherein said first and second arrays of current source share a common centroid.

7. The system of claim 1 , further comprising an analog-to-digital converter (ADC) coupled to said differential amplifier.

8. A system for measuring temperature in an integrated circuit comprising:

a first current source comprising a first array of current source elements;

a resistor with a predetermined voltage drop coupled to said first current source;

a first diode coupled to said resistor;

a programmable second current source comprising a second array of current source elements;

a second diode coupled to said second current source;

a comparator coupled to said resistor and to said second diode, said comparator generating a signal; and

a controller coupled to said programmable second current source and said comparator, said controller generating a programming value for controlling the programmable second current source such that said signal generated by said comparator toggles between a first and second state, wherein the programming value is related to a current temperature of the integrated circuit.

9. The system of claim 8 , further comprising a processor coupled to said comparator and to said controller.

10. The system of claim 9 , further comprising a fuse array coupled to said processor.

11. The system of claim 8 , wherein said first diode comprises a first array of diode elements and said second diode comprises a second array of diode elements.

12. The system of claim 11 , wherein said first array of diode elements and said second array of diode elements share a common centroid.

13. The system of claim 8 , wherein said first current source is programmable.

14. The system of claim 8 , wherein said first array of current source elements and said second array of current source elements share a common centroid.

15. The system of claim 14 , wherein each of said current source elements of said first array and said second array mirrors a current source in said controller.

16. The system of claim 11 , wherein said controller comprises a third current source comprising a third array of current source elements.

17. The system of claim 8 , wherein the first current source and the second current source are current controlled current sources.

18. The system of claim 8 , wherein the first current source and the second current source are voltage controlled current sources.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2015
From: INTELLECTUAL VENTURES ASSETS 16 LLC
To: QUEST PATENT RESEARCH CORPORATION
Reel/Frame 037098/0704 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2015
From: QUEST PATENT RESEARCH CORPORATION
To: IC KINETICS INC.
Reel/Frame 037102/0088 →
ASSIGNMENT EFFECTIVE AS OF JULY 1, 2015. Recorded Oct 9, 2015
From: INTELLECTUAL VENTURES HOLDING 81 LLC
To: INTELLECTUAL VENTURES ASSETS 16 LLC
Reel/Frame 036828/0253 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 036711 FRAME: 0160. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 6, 2015
From: INTELLECTUAL VENTURES FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036797/0356 →
MERGER Recorded Sep 29, 2015
From: INTELLECTUAL VENTURE FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036711/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2009
From: TRANSMETA LLC
To: INTELLECTUAL VENTURE FUNDING LLC
Reel/Frame 023268/0771 →
MERGER Recorded Mar 26, 2009
From: TRANSMETA CORPORATION
To: TRANSMETA LLC
Reel/Frame 022454/0522 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2003
From: SCHNAITTER, WILLIAM N.
To: TRANSMETA CORPORATION
Reel/Frame 013965/0860 →