Sheet resin composition and process for manufacturing semiconductor device therewith
View Patent ↗A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.
1. A method of fabricating a semiconductor device comprising:
coupling a sheet resin composition to an active surface of a wafer comprising bumps formed thereon;
back-grinding said wafer;
dicing said wafer to form a chip having said sheet resin composition coupled thereto;
coupling said sheet resin composition to a substrate; and
thermally melting and curing said sheet resin composition to underfill an interface between said chip and said substrate.
2. The method of claim 1 wherein said coupling a sheet resin composition to an active surface of a wafer comprises supporting said wafer with said sheet resin composition.
3. The method of claim 1 wherein said back-grinding comprises coupling said sheet resin composition to a grinding stage of a grinding device.
4. The method of claim 1 wherein said thermally melting comprises forming electrical connections between said substrates and said chip by said bumps.