Capacitor having RuSixOy-containing adhesion layers
View Patent ↗A capacitor structure includes a first electrode formed on a substrate assembly surface and on one or more side surfaces of a contact opening in the substrate assembly. A high- dielectric constant material is formed on at least a portion of the first electrode and a second electrode is formed on the high-dielectric constant material. At least one of the first and second electrodes comprises an adhesion layer formed of RuSi x O y , where x and y are in a range of about 0.01 to about 10. The adhesion layer of at least one of the first and second electrodes may be formed on at least a portion of a silicon-containing region. The adhesion layers may consist of three to five monolayers of RuSi x O y .
1. A capacitor structure comprising:
a first electrode formed on a substrate assembly surface and on one or more side surfaces of a contact opening in the substrate assembly;
a high dielectric constant material on at least a portion of the first electrode; and
a second electrode on the high dielectric constant material, wherein at least one of the first and second electrodes comprises an adhesion layer formed of RuSi x O y , where x and y are in a range of about 0.01 to about 10.
2. The structure of claim 1 , wherein x is in a range of about 0.01 to about 3.
3. The structure of claim 1 , wherein y is in a range of about 0.01 to about 1.
4. The structure of claim 3 , wherein x is about 0.4.
5. The structure of claim 3 , wherein y is about 0.05.
6. The structure of claim 1 , wherein the adhesion layer of the at least one of the first and second electrodes is formed on at least a portion of a silicon-containing region.
7. The structure of claim 1 , further comprising one or more conductive layers over the adhesion layer.
8. The structure of claim 7 , wherein the one or more conductive layers are formed of at least one metal.
9. The structure of claim 7 , wherein the one or more conductive layers are formed of at least one conductive metal oxide.
10. The structure of claim 7 , wherein the one or more conductive layers are formed from materials selected from a group consisting of RuO 2 , RhO 2 , MoO 2 , IrO 2 , Ru, Pt, Ir, W, WN, TaN, Os, and OsO 2 .
11. The structure of claim 1 , wherein the high dielectric constant material overlies an entire surface of the first electrode.
12. The structure of claim 1 , wherein the first and second electrodes comprise an adhesion layer formed of RuSi x O y .
13. The structure of claim 1 , wherein the adhesion layer consists of three to five monolayers of RuSi x O y .
14. A capacitor structure comprising:
a first electrode formed on a substrate assembly surface and on one or more side surfaces of a contact opening in the substrate assembly;
a high dielectric constant material on at least a portion of the first electrode; and
a second electrode on the high dielectric constant material, wherein at least one of the first and second electrodes comprises an adhesion layer formed of RuSi x O y , where x is about 0.4 and y is about 0.05.
15. The structure of claim 14 , wherein the adhesion layer of the at least one of the first and second electrodes is formed on at least a portion of a silicon-containing region.
16. The structure of claim 14 , further comprising one or more conductive layers over the adhesion layer.
17. The structure of claim 16 , wherein the one or more conductive layers are formed of at least one metal.
18. The structure of claim 16 , wherein the one or more conductive layers are formed of at least one conductive metal oxide.
19. The structure of claim 16 , wherein the one or more conductive layers are formed from materials selected from a group consisting of RuO 2 , RhO 2 , MoO 2 , IrO 2 , Ru, Pt, Ir, W, WN, TaN, Os, and OsO 2 .
20. The structure of claim 14 , wherein the high dielectric constant material overlies an entire surface of the first electrode.
21. The structure of claim 14 , wherein the first and second electrodes comprise an adhesion layer formed of RuSi x O y .
22. The structure of claim 14 , wherein the adhesion layer consists of three to five monolayers of RuSi x O y .
23. A capacitor structure comprising:
a first electrode formed on a substrate assembly surface and on one or more side surfaces of a contact opening in the substrate assembly;
a high dielectric constant material on at least a portion of the first electrode; and
a second electrode on the high dielectric constant material, wherein at least one of the first and second electrodes comprises an adhesion layer consisting of three to five monolayers of RuSi x O y , and where x and y are in a range of about 0.01 to about 3.