A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.
1. A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction, said processing apparatus adapted for removing wafer material from a front side and a back side of each wafer simultaneously, the carrier comprising:
a plate including wafer contaminating material and having an opening and a thickness; and
an insert having a thickness and being disposed in the opening of the plate for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates, the thickness of the insert being at least about 20 microns greater than the thickness of the plate to inhibit removal of the contaminating material from the plate during processing and thereby inhibit contamination of the wafer.
2. A wafer carrier as set forth in claim 1 wherein said insert is at least about 30 microns thicker than the plate.
3. A wafer carrier as set forth in claim 1 wherein said insert is at least about 50 microns thicker than the plate.
4. A wafer carrier as set forth in claim 1 wherein at least a portion of the plate is constructed of metal and wherein the insert is substantially free of metal.
5. A wafer carrier as set forth in claim 1 wherein the plate is coated to reduce a surface area of exposed metal.
6. A wafer carrier as set forth in claim 1 wherein the insert is removable from the plate and is not buoyant to inhibit the insert from separating from the plate during loading and unloading of wafers.
7. A wafer carrier as set forth in claim 6 wherein the insert is of one-piece construction.
8. A water carrier as set forth in claim 7 wherein the carrier has a center and wherein the insert is formed so that the at least one wafer is offset from the center.
9. A wafer carrier as set forth in claim 8 wherein the plate is generally ring-shaped and has gear teeth around its periphery.
10. A wafer carrier as set forth in claim 6 wherein the insert and plate have interengageable teeth for inhibiting movement of the insert relative to the plate during processing and f or allowing easy placement of the insert within the plate.
11. A water carrier as set forth in claim 12 wherein a pressure angle of each tooth is at least about 10° to distribute stress on the teeth and to allow for easy placement of the insert within the plate.
12. A wafer carrier as set forth in claim 10 wherein the teeth are sized and shaped to distribute stress on the teeth.
13. A wafer carrier for retaining at least two semiconductor wafers in a processing apparatus during a processing operation which removes water material by at least one of abrading and chemical reaction, said processing apparatus adapted for removing wafer material from a front side and a back side of each water simultaneously using a polishing fluid, the carrier comprising:
a plate including wafer contaminating material and having an opening; and
an insert removably disposed in the opening of the plate, the insert having holes for receiving said at least two wafers and engaging a peripheral edge of each water to hold each wafer as the carrier rotates, and the insert having negative buoyancy in the polishing fluid to inhibit the insert from separating from the plate during loading and unloading of wafers.
14. A wafer carrier as set forth in claim 13 wherein the carrier has a center, and wherein respective centers of the holes in the insert are offset from the center of the carrier.
15. A wafer carrier as set forth in claim 13 wherein said wafer contaminating material is metal and wherein the insert is substantially free of metal.
16. A wafer carrier as set forth in claim 15 wherein a thickness of the insert is at least about 20 microns greater than a thickness of the plate to inhibit removal of contaminating material from the plate during processing and thereby inhibit bulk metal contamination of the wafer.
17. A wafer carrier as set forth in claim 13 wherein the insert is of one-piece construction.
18. A wafer carrier as set forth in claim 17 wherein the plate is annular.
19. A wafer carrier as set forth in claim 18 wherein the insert and plate have engageable teeth for inhibiting movement of the insert relative to the plate during processing and for allowing easy placement of the insert within the plate.
20. A double-side polishing apparatus for polishing a front side and a back side of semiconductor wafers simultaneously, the apparatus comprising:
a rotatable upper platen mounting an upper polishing pad and a rotatable lower platen mounting a lower polishing pad;
a wafer carrier for retaining a set of the semiconductor wafers in between the upper and lower pads, the carrier including:
a) a plate made at least partially of metal and having an opening; and
b) an insert having a thickness and being disposed in the opening for receiving the set of wafers, the thickness of the insert being at least 20 microns greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.
21. The double-side polishing apparatus as set forth in claim 20 wherein said insect is at least about 30 microns thicker than the plate.
22. The double-side polishing apparatus as set forth in claim 21 wherein a gap between the plate and at least one of the upper and lower polishing pads is at least about 20 microns during polishing.
23. The double-side polishing apparatus as set forth in claim 20 wherein the opening in the plate is disposed entirely within the outer peripheries of the upper and lower polishing pads.
24. The double-side polishing apparatus as set forth in claim 20 wherein the carrier has a center, and wherein respective centers of the wafers in the insert are offset from the center of the carrier.
25. The double-side polishing apparatus as set forth in claim 24 wherein the lower polishing pad has a fluid thereon, and wherein the insert is removable from the plate and is not buoyant in the fluid to inhibit the insert from separating from the plate during loading and unloading of wafers from the apparatus.