A memory module for an electronic system, such as a personal computer or server, includes a double-sided, 184-pin, dual in-line memory module printed circuit board. A plurality of individual electronic components are mounted on both sides of the printed circuit board. Each electronic component includes an electronic component printed circuit board, a first pair of stacked memory dies electrically connected to the electronic component printed circuit board, a second pair of stacked memory dies electrically connected to the electronic component printed circuit board, and a thin small outline ball grid array package at least partially encapsulating the first and second pairs of stacked memory dies. Preferably, an insulator is disposed between each pair of stacked memory dies.
1. A memory module comprising,
(a) a first circuit board, and
(b) a plurality of electronic components mounted on said first circuit board, each electronic component comprising,
(i) a first memory die, and
(ii) a second memory die stacked on said first memory die,
(iii) an insulator disposed between the said first and second memory dies,
(iv) a second circuit board on which the first memory die is mounted, said first and second memory dies being independently electrically connected to the second circuit board, said second memory die being electrically connected to said second circuit board through at least one conductive wire, and
(v) a common package which at least partially encapsulates said first memory die, said second memory die, said insulator and said second circuit board.
2. The memory module as claimed in claim 1 wherein said first memory die, said second memory die, said insulator and said second circuit board are all at least partially encapsulated within a common thin small outline ball grid array (BGA) package.
3. The memory module as claimed in claim 2 wherein said first and second dies are identical.
4. The memory module as claimed in claim 1 wherein said first circuit board includes a plurality of electronic connection points.
5. The memory module as claimed in claim 4 wherein said first circuit board is a double-sided printed circuit board.
6. The memory module as claimed in claim 5 wherein said first circuit board is a 184-pin dual in-line memory module printed circuit board.
7. The memory module as claimed in claim 1 wherein each of said first and second memory dies includes a top side and a bottom side, said second memory die being stacked on said first memory die with said first memory die orientated in an inverted position and with said second memory die orientated with its top side facing up and away from said first memory die.
8. The memory module as claimed in claim 1 wherein said electronic component further comprises a third memory die and a fourth memory die.
9. The memory module as claimed in claim 8 wherein said first, second, third and fourth memory dies are all at least partially encapsulated within said common package.
10. The memory module as claimed in claim 9 wherein said fourth die is stacked on said third die.
11. The memory module as claimed in claim 10 wherein said first and third memory dies are mounted on the same surface of said second circuit board in a spaced apart, side-by-side relationship.
12. A memory module, comprising
(a) a first circuit board, and
(b) an electronic component mounted on said first circuit board, said electronic component comprising,
(i) a second circuit board,
(ii) a first pair of stacked memory dies mounted on said second circuit board,
(iii) a second pair of stacked memory dies mounted on said second circuit board, said first and second pairs of stacked memory dies being independently mounted on said second circuit board in a spaced apart and side-by-side relationship, and
(iv) a common package at least partially encapsulating both of said first and second pairs of stacked dies.
13. The memory module as claimed in claim 12 wherein an insulator is disposed between said first pair of stacked memory dies.
14. The memory module as claimed in claim 13 wherein an insulator is disposed between said second pair of stacked memory dies.
15. The memory module as claimed in claim 12 wherein said first and second pairs of stacked memory dies are identical.