IP Library Granted Patent US 6,861,642
Granted Patent B2
US 6,861,642 · App. 10/451,633 · Granted Mar 1, 2005

Neutral particle beam processing apparatus

Assignee: Ebara Corporation
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Quick Facts
Patent No.
US 6,861,642
App. No.
10/451,633
Granted
Mar 1, 2005
Kind
B2
Abstract

A neutral particle beam processing apparatus comprises a workpiece holder ( 20 ) for holding a workpiece (X), a plasma generator for generating a plasma in a vacuum chamber ( 3 ), an orifice electrode ( 5 ) disposed between the workpiece holder ( 20 ) and the plasma generator, and a grid electrode ( 4 ) disposed upstream of the orifice electrode ( 5 ) in the vacuum chamber ( 3 ). The orifice electrode ( 5 ) has orifices ( 5 a ) defined therein. The neutral particle beam processing apparatus further comprises a voltage applying unit for applying a voltage between the orifice electrode ( 5 ) and the grid electrode ( 4 ) via a dielectric ( 5 b ) to extract positive ions from the plasma generated by the plasma generator and pass the extracted positive ions through the orifices ( 5 a ) in the orifice electrode ( 5 ).

Claims (14)

1. A neutral particle beam processing apparatus comprising:

a workpiece holder for holding a workpiece;

a plasma generator for generating a plasma in a vacuum chamber;

an orifice electrode disposed between said workpiece holder and said plasma generator, said orifice electrode having orifices defined therein;

a grid electrode disposed upstream of said orifice electrode in said vacuum chamber; and

a voltage applying unit for applying a voltage between said orifice electrode and said grid electrode via a dielectric to extract positive ions from the plasma generated by said plasma generator and pass the extracted positive ions through said orifices in said orifice electrode.

2. A neutral particle beam processing apparatus according to claim 1 , wherein said dielectric comprises a dielectric film covering a surface of said orifice electrode.

3. A neutral particle beam processing apparatus comprising:

a workpiece holder for holding a workpiece;

a plasma generator for generating a plasma in a vacuum chamber;

an orifice electrode disposed between said workpiece holder and said plasma generator, said orifice electrode having orifices defined therein;

a grid electrode disposed upstream of said orifice electrode in said vacuum chamber; and

a voltage applying unit for applying a high-frequency voltage between said orifice electrode and said grid electrode via a dielectric to generate a plasma between said orifice electrode and said grid electrode and to extract positive ions from the generated plasma and pass the extracted positive ions through said orifices in said orifice electrode.

4. A neutral particle beam processing apparatus according to claim 3 , wherein said dielectric comprises a dielectric film covering a surface of said orifice electrode.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2017
From: TOHOKU TECHNO ARCH CO., LTD.
To: ASM IP HOLDING B.V.
Reel/Frame 041014/0522 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2008
From: EBARA CORPORATION
To: TOHOKU TECHNO ARCH CO., LTD.
Reel/Frame 021328/0642 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2003
From: ICHIKI, KATSUNORI; YAMAUCHI, KAZUO; HIYAMA, HIROKUNI; SAMUKAWA, SEIJI
To: EBARA CORPORATION
Reel/Frame 014751/0154 →
Priority Claims (1)
JP 2001-088866 · Mar 26, 2001 · national
Continuity (1)
Related Publication 20040070348A1 · Apr 15, 2004