IP Library Granted Patent US 7,344,603
Granted Patent B2
US 7,344,603 · App. 10/499,374 · Granted Mar 18, 2008

Solvent for treating polysilazane and method of treating polysilazane with the solvent

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Quick Facts
Patent No.
US 7,344,603
App. No.
10/499,374
Granted
Mar 18, 2008
Kind
B2
Abstract

Polysilazane is treated with a single or mixed solvent comprising one or more members selected from the group consisting of xylene, anisole, decalin, cyclohexane, cyclohexene, methylcyclohexane, ethylcyclohexane, limonene, hexane, octane, nonane, decane, a C8-C11 alkane mixture, a C8-C11 aromatic hydrocarbon mixture, an aliphatic/alicyclic hydrocarbon mixture containing 5 to 25% by weight of C8 or more aromatic hydrocarbons, and dibutyl ether, wherein the number of 0.5 micron or more fine particles contained in 1 ml of the solvent is 50 or less. As the treatment of polysilazane, there are illustrated, for example, edge-rinsing and back rinsing of a polysilazane film formed by spin coating polysilazane on a semiconductor substrate. The water content of the solvent is preferably 100 ppm or less.

Claims (2)

1. A method of removing, dissolving, rinsing or peeling polysilazane coated on an edge or a back of a substrate, which comprises contacting a composition comprising a solvent, which is a single or mixed solvent comprising one or more members selected from the group consisting of xylene, anisole, decalin, cyclohexane, cyclohexene, methylcyclohexane, ethylcyclohexane, limonene, hexane, octane, nonane, decane, a C8-C11 alkane mixture, a C8-C11 aromatic hydrocarbon mixture, an aliphatic/alicyclic hydrocarbon mixture containing 5 to 25 wt. % C8 or more aromatic hydrocarbons, and dibutyl ether, wherein the number of 0.5 micron or more fine particles contained in 1 ml of the solvent is 50 or less, and wherein the solvent has a water content of 100 ppm or less and said composition further comprises mineral spirit as a diluent solvent, with polysilazane and removing, dissolving, rinsing or peeling the polysilazane coated on the edge or the back of the substrate by jetting the composition onto the polysilazane.

2. The method of removing, dissolving, rinsing or peeling polysilazane coated on an edge or a back of a substrate according to claim 1 , wherein the polysilazane is coated on the substrate by applying a polysilazane solution onto the substrate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2015
From: AZ ELECTRONIC MATERIALS USA CORP.
To: MERCK PATENT GMBH
Reel/Frame 034742/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2005
From: CLARIANT FINANCE (BVI) LIMITED
To: AZ ELECTRONIC MATERIALS USA CORP.
Reel/Frame 015788/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2004
From: SHIMIZU, YASUO; SUZUKI, TADASHI
To: CLARIANT FINANCE (BVI) LIMITED
Reel/Frame 015713/0860 →