Substrate processing apparatus, substrate holder, and manufacturing method of semiconductor device
View Patent ↗A nonuniform portion of a film thickness on a substrate owing to effects of a support column, a substrate mounting portion, and the like which constitute a substrate holder is eliminated, and uniformity of the film thickness of the substrate is enhanced. A substrate processing apparatus houses plural wafers (substrates) held on a boat (substrate holder) in a processing chamber, supplying processing gas to the heated processing chamber, thereby performing film-forming processing for the wafers. The boat includes: at least three support columns 15 provided substantially vertically; plural wafer support portions 16 (substrate mounting portions) which are provided at multi-stages on the support columns and mount the plural wafers substantially horizontally at a predetermined interval; and plural ring-like plates 13 arranged on the support columns 15 , and provided substantially horizontally at a predetermined interval with respect to the wafers supported on the wafer support portions 16.
1. A substrate processing apparatus, comprising:
a substrate holder capable of holding plural substrates;
a processing chamber which houses the substrates held by the substrate holder; and
a heater which heats the processing chamber;
wherein the substrate holder includes:
at least three support columns provided substantially vertically;
plural substrate mounting portions which mount the plural substrates substantially horizontally at a predetermined interval, the substrate mounting portions being provided at multi-stages on the support columns so as to protrude from the support columns;
plural ring-like plates which surround the at least three support columns, are provided at multi-stages on the support columns, and are provided substantially horizontally at a predetermined interval with respect to the substrates supported on the substrate mounting portions; and
notches which are formed by notching inner circumferential surfaces of the ring-like plates, the inner circumferential surfaces being opposite to the support columns, on a periphery of the support columns, the support columns being fitted into the notches and being disposed inside an outer periphery of the ring-like plates.
2. The substrate processing apparatus according to claim 1 , wherein the substrate mounting portions are columnar shape or approximately semi-columnar shape.
3. The substrate processing apparatus according to claim 2 , wherein the substrate mounting portions are inclined downward toward an inside of the ring-like plates in a diameter direction.
4. The substrate processing apparatus according to claim 2 , wherein tips of the substrate mounting portions are rounded or chamfered.
5. The substrate processing apparatus according to claim 1 , wherein the support columns are composed into an approximately semi-columnar shape, and the substrate mounting portions are protruded on a chord side of the support columns.
6. The substrate processing apparatus according to claim 5 , wherein, on the chord side, an inside thereof in a diameter direction of the ring-like plates is scooped out.
7. The substrate processing apparatus according to claim 1 , wherein an open width of the notch is larger than a width of the substrate mounting portion.
8. The substrate processing apparatus according to claim 1 , wherein an open width of the notch is larger than an outside diameter of the support columns.
9. The substrate processing apparatus according to claim 1 , wherein the notch comprises:
a fitting portion as a hole into which the support columns is fitted; and
an opening which opens the fitting portion to the inner circumferential direction of the ring-like plate.
10. A substrate processing apparatus, comprising:
a substrate holder capable of holding plural substrates;
a processing chamber which houses the substrates held by the substrate holder; and
a heater which heats the processing chamber;
wherein the substrate holder includes:
at least three support columns provided substantially vertically;
plural ring-like plates which surround the at least three support columns, are provided at multi-stages on the support columns, and are provided substantially horizontally at a predetermined interval with respect to the substrates held by the substrate holder; and
notches which are formed by notching inner circumferential surfaces of the ring-like plates, the inner circumferential surfaces being opposite to the support columns, on a periphery of the support columns, the support columns being fitted into the notches and being disposed inside an outer periphery of the ring-like plates.
11. The substrate processing apparatus according to claim 10 , wherein the support columns are composed into an approximately semi-columnar shape, and the substrate mounting portions are protruded on a chord side of the support columns.
12. The substrate processing apparatus according to claim 11 , wherein, on the chord side, an inside thereof in a diameter direction of the ring-like plates is scooped out.
13. The substrate processing apparatus according to claim 10 , wherein an open width of the notch is larger than an outside diameter of a corresponding support column.
14. The substrate processing apparatus according to claim 10 , wherein the notch comprises:
a fitting portion as a hole into which the support columns is fitted; and
an opening which opens the fitting portion to the inner circumferential direction of the ring-like plate.
15. A substrate holder capable of holding plural substrates, comprising:
at least three support columns provided substantially vertically;
plural substrate mounting portions which mount the plural substrates substantially horizontally at a predetermined interval, the substrate mounting portions being provided at multi-stages on the support columns, so as to protrude from the support columns; and
plural ring-like plates which surround the at least three support columns, are provided at multi-stages on the support columns, and provided substantially horizontally at a predetermined interval with respect to the substrates supported on the substrate mounting portions,
wherein notches are formed by notching inner circumferential surfaces of the ring-like plates, the inner circumferential surfaces being opposite to the support columns, on a periphery of the support columns, and the support columns are fitted into the notches and being disposed inside an outer periphery of the ring-like plates.
16. The substrate processing apparatus according to claim 15 , wherein an open width of the notch is larger than a width of the substrate mounting portion.
17. The substrate processing apparatus according to claim 15 , wherein an open width of the notch is larger than an outside diameter of a corresponding support column.
18. The substrate processing apparatus according to claim 15 , wherein the notch comprises:
a fitting portion as a hole into which a corresponding support column is fitted; and
an opening which opens the fitting portion to the inner circumferential direction of the ring-like plate.
19. The substrate holder according to claim 15 , wherein the support columns are composed into an approximately semi-columnar shape, and the substrate mounting portions are protruded on a chord side of the support columns.
20. The substrate holder according to claim 19 , wherein, on the chord side, an inside thereof in a diameter direction of the ring-like plates is scooped out.
21. A substrate holder capable of holding plural substrates, comprising:
at least three support columns provided substantially vertically; and
plural ring-like plates which surround the at least three support columns, are provided at multi-stages on the support columns, and are provided substantially horizontally at a predetermined interval with respect to the substrates held by the substrate holder,
wherein notches are formed by notching inner circumferential surfaces of the ring-like plates, the inner circumferential surfaces being opposite to the support columns, on a periphery of the support columns, and the support columns are fitted into the notches and being disposed inside an outer periphery of the ring-like plates.
22. A method of manufacturing a semiconductor device, the method using a substrate processing apparatus including: a substrate holder capable of holding plural substrates; a processing chamber which houses the substrates held by the substrate holder; a heater which heats the processing chamber; and a gas supply pipe which supplies processing gas to the processing chamber heated by the heater, thereby processing the substrate, wherein the substrate holder includes: at least three support columns provided substantially vertically; plural substrate mounting portions which mount the plural substrates substantially horizontally at a predetermined interval, the substrate mounting portions being provided at multi-stages on the support columns so as to protrude from the support columns; plural ring-like plates which surround the at least three support columns, are provided at multi-stages on the support columns, and are provided substantially horizontally at a predetermined interval with respect to the substrates supported on the substrate mounting portions; and notches which are formed by notching inner circumferential surfaces of the ring-like plates, the inner circumferential surfaces being opposite to the support columns, on a periphery of the support columns, the support columns being fitted into the notches and being disposed inside an outer periphery of the ring-like plates, the method comprising:
mounting the substrates on the substrate mounting portions of the substrate holder;
carrying the substrates mounted on the substrate mounting portions of the substrate holder into the processing chamber;
heating the processing chamber by the heater; and
supplying the processing gas to the heated processing chamber by the gas supply pipe, thereby processing the substrate.