IP Library Granted Patent US 7,550,723
Granted Patent B2
US 7,550,723 · App. 10/592,844 · Granted Jun 23, 2009

Atom probe apparatus and method for working sample preliminary for the same

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Quick Facts
Patent No.
US 7,550,723
App. No.
10/592,844
Granted
Jun 23, 2009
Kind
B2
Abstract

A preliminary processing technology for a sample locally cuts out a sample part of a device to be analyzed and processes it into a needle-like projection, and a technology of realizing SAP analysis on an atomic level by ensuring stabilized ion evaporation sequentially even in the case of a sample of multilayer structure including an element layer of small evaporation electric field. The preliminary processing method for a sample used on atom probe apparatus comprises a step for cutting the desired observing part of the sample into a block using an FIB equipment, a step for transferring the sample block onto a sample substrate and fixing the sample block in place, and a step for processing the sample block fixed onto the sample substrate into a needle-point shape by FIB etching. The sample processed into a needle-point shape is shaped such that the layer direction of the multilayer structure becomes parallel to the longitudinal direction of the needle.

Claims (16)

1. A method for working a sample preliminarily for an atom probe apparatus, comprising: a step of cutting out a desired sample observation part to a block-like form by using an FIB apparatus; a step of carrying and fixing the block-like cut-out sample onto a sample substrate; and a step of working the block-like sample fixed onto the sample substrate into a needle tip shape by an FIB etching, wherein the step of fixing the block-like cut-out sample onto the sample substrate includes a step of temporarily bonding it by an FIB-CVD, a step of cutting in a groove over a base part of the block-like sample and the sample substrate by an FIB etching, and a step of applying the FIB-CVD to the cut-in portion, thereby bonding and fixing the sample substrate and the block-like sample.

2. A method for working a sample preliminarily for an atom probe apparatus according to claim 1 ; wherein a finish working for working the block-like sample into the needle tip shape by the FIB etching is performed by an acceleration voltage of 10 kV or lower, thereby shallowing a damage layer.

3. A method for working a sample preliminarily for an atom probe apparatus according to claim 2 ; further comprising a step of additionally removing, after performing the finish working by the acceleration voltage of 10 kV or lower, the damage layer by a low acceleration Ar ion milling.

4. A sample for an atom probe apparatus, characterized in that the sample worked into a needle tip shape is formed such that a layer direction of a multilayer structure becomes parallel to a longitudinal direction of a needle.

5. A method of preparing a sample for an atom probe apparatus, comprising:

cutting out a sample block from a sample using a focused ion beam;

temporarily fixing a base part of the sample block to a substrate;

etching a groove in the base part of the temporarily fixed sample block and in the substrate using a focused ion beam;

completely fixing the sample block to the substrate by bonding using focused-ion-beam-assisted chemical vapor deposition applied to the groove; and

etching the completely fixed sample block into a needle shape using a focused ion beam.

6. A method according to claim 5 ; including etching plural grooves in the base part of the temporarily fixed sample block and in the substrate using a focused ion beam; and completely fixing the sample block to the substrate by bonding using focused-ion-beam-assisted chemical vapor deposition applied to the plural grooves.

7. A method according to claim 5 ; wherein the etching of the completely fixed sample block into a needle tip shape using a focused ion beam includes a finish working in which the etching is performed by the focused ion beam at an acceleration voltage of 10 kV or lower.

8. A method according to claim 7 ; further including removing a damage layer from the needle tip shape, caused by the focused ion beam etching, by ion milling.

9. A method according to claim 8 ; wherein the ion milling is carried out using Ar ions.

10. A method according to claim 5 ; wherein the temporarily fixing a base part of the sample block to a substrate is carried out by bonding using focused-ion-beam-assisted chemical vapor deposition.

11. A multilayer sample for an atom probe apparatus, in which the sample has a needle shape and a multilayer structure, and in which the layer direction of the multilayer structure is parallel to a longitudinal direction of the needle.

Assignments (2)
CHANGE OF NAME Recorded Sep 25, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033817/0078 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2006
From: KAITO, TAKASHI
To: SII NANTECHNOLOGY INC.
Reel/Frame 018591/0668 →