IP Library › Granted Patent US 6,811,473
Granted Patent Utility
US 6,811,473 · Confirmation No. 7972

PROCESS FOR MACHINING A WAFER-LIKE WORKPIECE

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2004-09-17 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-08-02 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-08-02 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-08-02 1449 List of References cited by applicant and considered by examiner 1 View
2004-08-02 892 List of references cited by examiner 1 View
2004-08-02 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-08-02 SRFW Search information including classification, databases and other search related notes 1 View
2004-08-02 BIB Bibliographic Data Sheet 2 View
2004-03-19 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2004-03-19 FOR Foreign Reference 1 View
2003-06-27 TRNA Transmittal of New Application 2 View
2003-06-27 SPEC Specification 7 View
2003-06-27 CLM Claims 2 View
2003-06-27 ABST Abstract 1 View
2003-06-27 DRW Drawings-only black and white line drawings 1 View
2003-06-27 OATH Oath or Declaration filed 3 View
2003-06-27 LET. Miscellaneous Incoming Letter 1 View
2003-06-27 FRPR Certified Copy of Foreign Priority Application 9 View
2003-06-27 WCLM Claims Worksheet (PTO-2022) 1 View
2003-06-27 WFEE Fee Worksheet (SB06) 1 View
2003-06-27 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
Patent No.
US 6,811,473
App. No.
10/607,626
Filed
2003-06-27
Granted
2004-11-02
Pub. No.
US20040043709A1
Art Unit
3723
PTA
0 days