Magnetically lined conductors
View Patent ↗A conductor with improved magnetic field per current ratio is disclosed. The conductor includes a magnetic liner lining a second surface and sides thereof. The magnetic liner is preferably a super-paramagnet with high susceptibility or a ferromagnet with a microstructure where the size of the non-exchanged coupled micro domains is so small that their energy content is close to or small compared to kT that such films have super-paramagnetic properties and essentially behave like a paramagnet with high susceptibility.
1. An integrated circuit comprising:
a conductor for generating a magnetic field, the conductor having first and second surfaces and sides; and
a magnetic liner lining at least the sides and second surface of the conductor,
wherein the magnetic liner has super-paramagnetic properties and comprises a ferromagnetic film selected from the group consisting essentially of:
spin-on film made out of ferromagnetic particles in a high thermal stability polymer; and
evaporated multilayer films made out of repeated layers of Terbium and ferromagnetic particles.
2. The integrated circuit of claim 1 wherein the liner comprises a super-paramagnet with high susceptibility.
3. The integrated circuit of claim 1 , wherein the ferromagnetic film has a microstructure having non-exchanged coupled micro domains whose size is so small that their energy content is close to or small compared to kT, whereby such film has super-paramagnetic properties.
4. The integrated circuit of claim 1 , wherein the liner further comprises a first diffusion barrier between an outer surface of the liner and a dielectric layer in which the conductor is disposed and a second diffusion barrier disposed between an inner surface of the liner and the conductive line.
5. The integrated circuit of claim 4 , wherein the diffusion barriers are Tantalum nitride/Tantalum.
6. The integrated circuit of claim 1 wherein the first surface is adjacent to a magnetic element.
7. The integrated circuit of claim 6 wherein the first surface is either a top or bottom surface of the conductor.
8. The integrated circuit of claim 6 wherein the liner further comprises a first diffusion barrier between an outer surface of the liner and a dielectric layer in which the conductor is disposed and a second diffusion barrier disposed between an inner surface of the liner and the conductive line.