Multi chip module
View Patent ↗A multi chip package, which includes a package substrate having a first side and an opposing second side. The first side is for receiving package electrical connections. Integrated circuits are electrically connected and structurally connected by their first sides to the second side of the package substrate. Heat spreaders are disposed adjacent the second side of the integrated circuits, where one each of the heat spreaders is associated with one each of the integrated circuits. A single stiffener having a first side and an opposing second side covers all of the integrated circuits and heat spreaders, where the first side of the stiffener is disposed adjacent the second side of the heat spreaders.
1. A multi chip package, comprising:
a package substrate having a first side and an opposing second side, the first side for receiving package electrical connections,
integrated circuits each having a first side and an opposing second side, the first side of each of the integrated circuits electrically connected and structurally connected to the second side of the package substrate,
heat spreaders each having a first side and an opposing second side, the first side of each of the heat spreaders disposed adjacent the second side of the integrated circuits, where one each of the heat spreaders is associated with one each of the integrated circuits,
a single stiffener having a first side and an opposing second side, the stiffener covering all of the integrated circuits and heat spreaders, the first side of the stiffener disposed adjacent the second side of the heat spreaders, and
discrete components electrically connected to the second side of the package substrate and coplanar with the integrated circuits.
2. The multi chip package of claim 1 , further comprising ball grid array package electrical connections disposed on the first side of the package substrate.
3. The multi chip package of claim 1 , wherein the heat spreaders are formed of copper.
4. The multi chip package of claim 1 , wherein the stiffener is formed of copper.
5. A multi chip package, comprising:
a package substrate having a first side and an opposing second side, the first side for receiving package electrical connections,
integrated circuits each having a first side and an opposing second side, the first side of each of the integrated circuits electrically connected and structurally connected to the second side of the package substrate,
heat spreaders each having a first side and an opposing second side, the first side of each of the heat spreaders disposed adjacent the second side of the integrated circuits, where one each of the heat spreaders is associated with one each of the integrated circuits,
a thermal epoxy disposed between the second side of each of the integrated circuits and the first side of each of the heat spreaders, the thermal epoxy for conducting thermal energy to the heat spreaders and away from the integrated circuits, and
a single stiffener having a first side and an opposing second side, the stiffener covering all of the integrated circuits and heat spreaders, the first side of the stiffener disposed adjacent the second side of the heat spreaders.
6. The multi chip package of claim 5 , further comprising ball grid array package electrical connections disposed on the first side of the package substrate.
7. The multi chip package of claim 5 , wherein the heat spreaders are formed of copper.
8. The multi chip package of claim 5 , wherein the stiffener is formed of copper.
9. A multi chip package, comprising:
a package substrate having a first side and an opposing second side, the first side for receiving package electrical connections,
integrated circuits each having a first side and an opposing second side, the first side of each of the integrated circuits electrically connected and structurally connected to the second side of the package substrate,
heat spreaders each having a first side and an opposing second side, the first side of each of the heat spreaders disposed adjacent the second side of the integrated circuits, where one each of the heat spreaders is associated with one each of the integrated circuits,
a single stiffener having a first side and an opposing second side, the stiffener covering all of the integrated circuits and heat spreaders, the first side of the stiffener disposed adjacent the second side of the heat spreaders, and
a thermal epoxy disposed between the second side of each of the heat spreaders and the first side of the stiffener, the thermal epoxy for conducting thermal energy to the stiffener and away from the heat spreaders.
10. The multi chip package of claim 9 , further comprising ball grid array package electrical connections disposed on the first side of the package substrate.
11. The multi chip package of claim 9 , wherein the heat spreaders are formed of copper.
12. The multi chip package of claim 9 , wherein the stiffener is formed of copper.
13. A multi chip package, comprising:
a package substrate having a first side and an opposing second side, the first side for receiving package electrical connections,
integrated circuits each having a first side and an opposing second side, the first side of each of the integrated circuits electrically connected and structurally connected to the second side of the package substrate,
heat spreaders each having a first side and an opposing second side, the first side of each of the heat spreaders disposed adjacent the second side of the integrated circuits, where one each of the heat spreaders is associated with one each of the integrated circuits, and
a single stiffener having a first side and an opposing second side, the stiffener covering some but not all of the integrated circuits and heat spreaders, the first side of the stiffener disposed adjacent the second side of the heat spreaders.
14. The multi chip package of claim 13 , further comprising a thermal epoxy disposed between the second side of each of the integrated circuits and the first side of each of the heat spreaders, the thermal epoxy for conducting thermal energy to the heat spreaders and away from the integrated circuits.
15. The multi chip package of claim 13 , further comprising a thermal epoxy disposed between the second side of each of the heat spreaders and the first side of the stiffener, the thermal epoxy for conducting thermal energy to the stiffener and away from the heat spreaders.
16. The multi chip package of claim 13 , further comprising discrete components electrically connected to the second side of the package substrate and coplanar with the integrated circuits.
17. The multi chip package of claim 13 , further comprising bail grid array package electrical connections disposed on the first side of the package substrate.
18. The multi chip package of claim 13 , wherein the heat spreaders are formed of copper.