Wirebonding insulated wire and capillary therefor
View Patent ↗An improved method of bonding an insulated wire ( 14 ) that has one end connected to a first bond pad ( 16 ) to a second bond pad ( 18 ) includes moving a tip of a capillary ( 20 ) holding the bond wire ( 14 ) over the surface of the second bond pad ( 18 ) such that the bond wire ( 14 ) is rubbed between the capillary tip ( 20 ) and the second bond pad ( 18 ), which tears the bond wire insulation so that at least a portion of a metal core of the wire ( 14 ) contacts the second bond pad ( 18 ). The wire ( 14 ) is then bonded to the second pad ( 18 ) using thermocompression bonding. The tip of the capillary ( 20 ) is roughened to enhance the tearing of the bond wire insulation.
1. A method of electrically connecting a first device to a second device with an insulated wire, the method comprising the steps of:
forming a first bond by wirebonding a first end of the insulated wire to a first bond pad of the first device, thereby electrically connecting the bond wire and the first device;
moving a tip of a capillary holding the bond wire over the surface of second bond pad of the second device such that the bond wire is rubbed between the capillary tip and the second bond pad horizontally thereby tearing the bond wire insulation so that at least a portion of a metal core of the wire contacts the second bond pad, wherein the capillary has a roughened tip that enhances abrasion of the insulation during said moving step; and
bonding at least the exposed portion of the bond wire to the second bond pad via thermocompression bonding, thereby electrically connecting the first device and the second device.
2. The electrical connection method of claim 1 , wherein the moving step includes moving the capillary tip such that the capillary movement has a combination of a positive shift movement in a first direction over the second bond pad and a negative shaft movement move in a second direction over the second bond pad.
3. The electrical connection method of claim 1 , wherein the bonding step includes thermocompression bonding and a very low amount of ultrasonic energy.
4. The electrical connection method of claim 1 , wherein the first bond comprises a ball bond.
5. The electrical connection method of claim 4 , wherein the second bond comprises a stitch bond.
6. The electrical connection method of claim 1 , wherein the second device comprises a carrier and the second bond pad is a lead finger.
7. The electrical connection method of claim 1 , further comprising the step of heating the second bond pad prior to said moving step.
8. The electrical connection method of claim 1 , wherein the insulated wire comprises one of a gold, copper or aluminum wire having an organic insulative coating.
9. The electrical connection method of claim 8 , wherein the insulated wire has a diameter of less than about 25 um.
10. The electrical connection method of claim 9 , wherein the insulative coating has a thickness of about 0.5 um to 2.0 um.
11. An improved method of bonding an insulated wire having one end connected to a first bond pad to a second bond pad, the improved method comprising the steps of:
moving a tip of a capillary holding the bond wire over the surface of the second bond pad such that the bond wire is rubbed between the capillary tip and the second bond pad, thereby tearing the bond wire insulation so that at least a portion of a metal core of the wire contacts the second bond pad, wherein the capillary has a roughened tip that enhances abrasion of the insulation during said moving step; and
bonding the exposed portion of the bond wire to the second bond pad via thermocompression bonding.
12. The electrical connection method of claim 11 , wherein the moving step includes moving the capillary tip such that the capillary movement has a combination of a positive shift movement in a first direction over the second bond pad and a negative shift movement move in a second direction over the second bond pad.
13. The electrical connection method of claim 11 , wherein the thermocompression bonding uses a very small amount of ultrasonic energy.
14. The electrical connection method of claim 11 , wherein the second bond comprises a stitch bond.
15. The electrical connection method of claim 14 , wherein the second bond pad comprises a carrier finger.
16. The electrical connection method of claim 11 , further comprising the step of heating the second bond pad prior to said moving step.
17. The electrical connection method of claim 11 , wherein the insulated wire comprises one of a gold, copper or aluminum wire having an organic insulative coating.
18. The electrical connection method of claim 17 , wherein the insulated wire has a diameter of less than about 25 um and the insulative coating has a thickness of about 0.5 um to 2.0 um.
19. An improved method of bonding an insulated wire having one end connected to a first bond pad to a second bond pad, the improved method comprising the steps of:
providing a capillary having a roughened tip for holding the insulated wire;
moving the tip of the capillary over a surface of the second bond pad such that the wire is rubbed between the capillary tip and the second bond pad, thereby tearing the insulation so that at least a portion of a metal core of the wire contacts the second bond pad; and
bonding the exposed portion of the wire to the second bond pad via thermocompression bonding.
20. The electrical connection method of claim 19 , further comprising the step of heating the second bond pad prior to said moving step.
21. The electrical connection method of claim 19 , wherein the insulated wire comprises one of a gold, copper or aluminum wire having an organic insulative coating.
22. The electrical connection method of claim 21 , wherein the insulated wire has a diameter of less than about 25 um and the insulative coating has a thickness of about 0.5 um to 2.0 um.