Reinforced bond pad
View Patent ↗Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.
1. A wire bonding pad reinforcing system for an integrated circuit of the type using brittle inter-level dielectrics comprising:
a wire bonding pad formed of a metal;
a metal reinforcing layer formed under and in contact with the wire bonding pad, the metal reinforcing layer being structured to stiffen the wire bonding pad and to distribute bonding forces over an extended area;
at least one metal layer disposed under and in contact with said reinforcing layer; and
at least one brittle inter-level dielectric extending within the integrated circuit below said at least one metal layer.
2. The reinforcing system of claim 1 wherein the metal of the reinforcing layer is a refractory metal.
3. The reinforcing system of claim 1 wherein said reinforcing layer is a patterned structure.
4. The reinforcing system of claim 1 wherein the metal of the contact pad is selected from the group comprising aluminum, copper and alloys of aluminum and copper.
5. The reinforcing system of claim 1 wherein the metal of the reinforcing layer is selected from the group comprising titanium, titanium nitride, tungsten, tungsten nitride, nickle, and alloys or combinations thereof.
6. The reinforcing system of claim 1 , wherein said reinforcing layer is 100-600 nm thick.