IP Library Granted Patent US 6,898,124
Granted Patent B1
US 6,898,124 · App. 10/678,446 · Granted May 24, 2005

Efficient and accurate sensing circuit and technique for low voltage flash memory devices

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Quick Facts
Patent No.
US 6,898,124
App. No.
10/678,446
Granted
May 24, 2005
Kind
B1
Abstract

An exemplary sensing circuit comprises a first transistor connected to a first node, where a target memory cell has a drain capable of being connected to the first node through a selection circuit during a read operation involving the target memory cell. The sensing circuit further comprises a decouple circuit which is connected to the first transistor. The decouple circuit includes a second transistor having a gate coupled to a gate of the first transistor. The decouple circuit further has a decouple coefficient (N) greater than 1. The drain of the second transistor is connected at a second node to a reference voltage through a bias resistor. With the arrangement, the drain of the second transistor generates a sense amp input voltage at the second node such that the sense amp input voltage is decoupled from the first node.

Claims (26)

1. A sensing circuit for a target memory cell, said sensing circuit comprising:

said target memory cell having a drain capable of being connected to a first node through a selection circuit during a read operation involving said target memory cell, said target memory cell drawing a target memory cell current when activated during said read operation;

a first transistor being connected to said first node;

a decouple circuit being connected to said first transistor, said decouple circuit including a second transistor having a gate width greater than a gate width of said first transistor, a gate of said second transistor being coupled to a gate of said first transistor, said decouple circuit further having a decouple coefficient (N) greater than 1, a drain of said second transistor being connected at a second node to a reference voltage through a bias resistor, said drain of said second transistor generating a sense amp input voltage at said second node such that said sense amp input voltage is decoupled from said first node.

2. The sensing circuit of claim 1 wherein said gate of said second transistor is N times wider than said gate of said first transistor.

3. The sensing circuit of claim 1 wherein said decouple circuit draws a mirror current N times larger than said target memory cell current.

4. The sensing circuit of claim 1 wherein said first transistor comprises a first PFET, and said second transistor comprises a second PFET, said gate of said first PFET connected to a drain of said first PFET, a source of said first PFET and a source of said second PFET being connected to a supply voltage.

5. The sensing circuit of claim 1 wherein said reference voltage is ground.

6. The sensing circuit of claim 1 wherein said target memory cell is capable of storing four charge levels.

7. The sensing circuit of claim 6 wherein said four charge levels comprises a first charge level drawing approximately 0 microamperes during said read operation, a second charge level drawing approximately 10 microamperes during said read operation, a third charge level drawing approximately 15 microamperes during said read operation, and a fourth charge level drawing approximately 20 microamperes during said read operation.

8. A multi-level charge memory device comprising:

a target memory cell having a drain capable of being connected to a first node through a selection circuit during a read operation involving said target memory cell, said target memory cell drawing a target memory cell current when activated during said read operation; and

a sensing circuit comprising a first transistor connected to a decouple circuit, said first transistor being connected to said first node, said decouple circuit including a second transistor having a gate width greater than a gate width of said first transistor, a gate of said second transistor being coupled to a gate of said first transistor, said decouple circuit further having a decouple coefficient (N) greater than 1, a drain of said second transistor being connected at a second node to a reference voltage through a bias resistor, said drain of said second transistor generating a sense amp input voltage at said second node such that said sense amp input voltage is decoupled from said first node.

9. The multi-level charge memory device of claim 8 wherein said gate of said second transistor is N times wider than said gate of said first transistor.

10. The multi-level charge memory device of claim 8 wherein said decouple circuit draws a mirror current N times larger than said target memory cell current.

11. The multi-level charge memory device of claim 8 wherein said first transistor comprises a first PFET, and said second transistor comprises a second PFET, said gate of said first PFET connected to a drain of said first PFET, a source of said first PFET and a source of said second PFET being connected to a supply voltage.

12. The multi-level charge memory device of claim 8 wherein said reference voltage is ground.

13. The multi-level charge memory device of claim 8 wherein said target memory cell is capable of storing four charge levels.

14. The multi-level charge memory device of claim 13 wherein said four charge levels comprises a first charge level drawing approximately 0 microamperes during said read operation, a second charge level drawing approximately 10 microamperes during said read operation, a third charge level drawing approximately 15 microamperes during said read operation, and a fourth charge level drawing approximately 20 microamperes during said read operation.

15. A sensing circuit for a target memory cell, said target memory cell having a drain capable of being connected to a first node through a selection circuit during a read operation involving said target memory cell, said target memory cell drawing a target memory cell current when activated during said read operation, a first transistor being connected to said first node, said sensing circuit being characterized by:

a decouple circuit being connected to said first transistor, said decouple circuit including a second transistor having a gate width greater than a gate width of said first transistor, a gate of said second transistor being coupled to a gate of said first transistor, said decouple circuit further having a decouple coefficient (N) greater than 1, a drain of said second transistor being connected at a second node to a reference voltage through a bias resistor, said drain of said second transistor generating a sense amp input voltage at said second node such that said sense amp input voltage is decoupled from said first node.

16. The sensing circuit of claim 15 wherein said gate of said second transistor is N times wider than said gate of said first transistor.

17. The sensing circuit of claim 15 wherein said decouple circuit draws a mirror current N times larger than said target memory cell current.

18. The sensing circuit of claim 15 wherein said first transistor comprises a first PFET, and said second transistor comprises a second PFET, said gate of said first PFET connected to a drain of said first PFET, a source of said first PFET and a source of said second PFET being connected to a supply voltage.

19. The sensing circuit of claim 15 wherein said reference voltage is ground.

20. The sensing circuit of claim 15 wherein said target memory cell is capable of storing four charge levels.

Assignments (11)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036037/0495 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2007
From: SPANSION INC.
To: SPANSION LLC
Reel/Frame 019069/0372 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2007
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION INC.
Reel/Frame 019047/0730 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2003
From: WANG, ZHIGANG; YANG, NIAN; HE, YUE-SONG
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 014591/0746 →