IP Library › Granted Patent US 7,071,548
Granted Patent B2
US 7,071,548 · App. 10/696,825 · Granted Jul 4, 2006

Semiconductor coated with a mixture containing an adhesion promoter

Assignee: Hewlett-Packard Development Company, L.P.
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Quick Facts
Patent No.
US 7,071,548
App. No.
10/696,825
Granted
Jul 4, 2006
Kind
B2
Abstract

An article comprises a semiconductor substrate and a coating mixture on the semiconductor substrate. The coating mixture Is comprised of adhesion promoter and photopolymer. The adhesion promoter contains α-amino propyltriethoxysilane in organic solution.

Claims (4)

1. An article comprising a semiconductor substrate; and a coating mixture comprised of adhesion promoter and photopolymer the semiconductor substrate, the adhesion promoter containing α-amino propyltriethoxysilane in organic solution.

2. The article of claim 1 wherein said semiconductor substrate is a flexible amorphous silicon-coated web.

3. The article of claim 1 wherein the photopolymer contains mercapto-ester in solution.

4. The article of claim 3 wherein said coating mixture is applied to said semiconductor substrate using spin coating.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2014
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: APPLIED MATERIALS, INC.
Reel/Frame 033576/0067 →
Continuity (2)
Division 1013327400 · Apr 26, 2002
Related Publication 20040097097A1 · May 20, 2004