IP Library › Assignment 033576/0067
Patent Assignment
Reel/Frame 033576/0067

Assignment of Assignor's Interest

Recorded: 2014-08-20 Pages: 6
Assignor
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (26)
Optical-Mechanical Feature Fabrication During Manufacture of Semiconductors and Other Micro-Devices and Nano-Devices That Include Micron and Sub-Micron Features
Patent: 6,653,030 →
Application: 10/058,744 →
Publication: US 2003/0138704
Method and System for Forming a Semiconductor Device
Patent: 6,861,365 →
Application: 10/184,567 →
Publication: US 2004/0002216
Apparatus for Embossing a Flexible Substrate with a Pattern Carried by an Optically Transparent Compliant Media
Patent: 7,070,406 →
Application: 10/425,798 →
Publication: US 2004/0219246
Method of Replicating a High Resolution Three-Dimensional Imprint Pattern on a Compliant Media of Arbitrary Size
Patent: 6,808,646 →
Application: 10/425,891 →
Publication: US 2004/0217085
Semiconductor Coated with a Mixture Containing an Adhesion Promoter
Patent: 7,071,548 →
Application: 10/696,825 →
Publication: US 2004/0097097
Forming a Plurality of Thin-Film Devices Using Imprint Lithography
Patent: 7,056,834 →
Application: 10/777,005 →
Publication: US 2005/0176182
Micro-Casted Silicon Carbide Nano-Imprinting Stamp
Patent: 7,080,596 →
Application: 10/794,928 →
Publication: US 2004/0169003
Forming a Plurality of Thin-Film Devices
Patent: 7,195,950 →
Application: 10/895,584 →
Publication: US 2006/0019504
Method of Forming at Least One Thin Film Device
Patent: 7,202,179 →
Application: 11/025,750 →
Publication: US 2006/0134922
Pattern Reversal Process for Self Aligned Imprint Lithography and Device
Patent: 7,585,424 →
Application: 11/037,886 →
Publication: US 2006/0157443
Thin Film Device Active Matrix by Pattern Reversal Process
Patent: 7,521,313 →
Application: 11/037,887 →
Publication: US 2006/0160278
Method for Forming an Electronic Device
Patent: 8,097,400 →
Application: 11/062,384 →
Publication: US 2006/0188823
Sensor Array Using Sail
Patent: 7,470,544 →
Application: 11/138,619 →
Publication: US 2006/0270057
Structure and Method for Thin Film Device
Patent: 7,341,893 →
Application: 11/144,204 →
Publication: US 2006/0275963
Structure and Method for Thin Film Device with Stranded Conductor
Patent: 7,994,509 →
Application: 11/264,321 →
Publication: US 2007/0096169
Method and System for Forming a Thin Film Device
Patent: 7,678,626 →
Application: 11/285,879 →
Publication: US 2007/0117278
Method and Structure for Facilitating Etching
Patent: 7,291,564 →
Application: 11/414,411 →
Fabricating a Structure Usable in an Imprint Lithographic Process
Patent: 7,718,077 →
Application: 11/493,478 →
Thin Film Devices and Methods for Forming the Same
Patent: 7,541,227 →
Application: 11/589,580 →
Publication: US 2007/0040491
Thin Film Device with Minimized Spatial Variation of Local Mean Height
Patent: 8,765,252 →
Application: 11/948,867 →
Publication: US 2009/0142560
Structure and Method for Thin Film Device
Patent: 8,269,221 →
Application: 12/011,440 →
Publication: US 2008/0185591
Thin Film Device Fabrication Process Using 3D Template
Patent: 8,021,935 →
Application: 12/243,073 →
Publication: US 2010/0078640
Display
Patent: 8,568,182 →
Application: 12/891,414 →
Publication: US 2012/0075185
Electronic Apparatus
Patent: 8,877,531 →
Application: 13/074,259 →
Publication: US 2012/0074433
Method for Thin Film Device with Stranded Conductor
Patent: 8,318,610 →
Application: 13/172,543 →
Publication: US 2011/0256725
Method of Fabricating A Color Filter Array Using a Multilevel Structure
Patent: 9,535,315 →
Application: 14/355,507 →
Publication: US 2014/0268384
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2002
From: MEI, PING; TAUSSIG, CARL P.; JEANS, ALBERT H.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 012546/0797 →
Assignment of Assignor's Interest Oct 29, 2002
From: TAUSSIG, CARL PHILIP; MEI, PING
To: HEWLETT-PACKARD COMPANY
Reel/Frame 013443/0403 →
Assignment of Assignor's Interest Apr 29, 2003
From: JEANS, ALBERT H.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 014025/0794 →
Assignment of Assignor's Interest Apr 29, 2003
From: JEANS, ALBERT H.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 014025/0781 →
Assignment of Assignor's Interest Jun 18, 2003
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 013776/0928 →
Assignment of Assignor's Interest Sep 30, 2003
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.
Reel/Frame 014061/0492 →
Assignment of Assignor's Interest Jul 21, 2004
From: TAUSSIG, CARL; MEI, PING; HAMBURGEN, WILLIAM
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 015602/0828 →
Assignment of Assignor's Interest Nov 4, 2004
From: MEL, PING; JACKSON, WARREN; TAUSSIG, CARL PHILLIP; JEANS, ALERT
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 015339/0115 →
Assignment of Assignor's Interest Dec 22, 2004
From: TAUSSIG, CARL P.; MEI, PING; KIM, HAN-JUN
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016142/0356 →
Assignment of Assignor's Interest Jan 18, 2005
From: MEI, PING
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
Reel/Frame 016211/0458 →
Assignment of Assignor's Interest Jan 18, 2005
From: MEI, PING
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016199/0403 →
Assignment of Assignor's Interest Feb 22, 2005
From: JACKSON, WARREN; TAUSSIG, CARL; MEI, PING
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016317/0389 →
Assignment of Assignor's Interest May 26, 2005
From: SHARMA, MANISH
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016609/0887 →
Assignment of Assignor's Interest Jun 2, 2005
From: MEI, PING; JEANS, ALBERT; TAUSSIG, CARL
To: HEWLETT-PACKARD DEVELOPMENT COMPANY LP.
Reel/Frame 016663/0564 →
Assignment of Assignor's Interest Nov 1, 2005
From: MEI, PING; LUO, HAU; TAUSSIG, CARL
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
Reel/Frame 017174/0364 →
Assignment of Assignor's Interest Nov 23, 2005
From: PERLOV, CRAIG; MEI, PING
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 017277/0099 →
Assignment of Assignor's Interest Jul 24, 2006
From: JACKSON, WARREN
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 018084/0159 →