Electronic apparatus
An electronic apparatus is provided that includes a number of first components on a first substrate and a number of second components on a second substrate. A lamination material that includes a conducting material is placed between the first components and the second components. Any one first component can couple to a varied subset of second components.
1. A method of forming a display, comprising:
forming a first electrode layer on a first substrate;
forming an organic light emitting diode (OLED) stack on the first electrode layer;
forming a second electrode layer over the OLED stack;
patterning the second electrode layer to form a plurality of micro-OLEDs; and
laminating the plurality of micro-OLEDs on the first substrate to a plurality of pixels in an electronic backplane on a second substrate, wherein a lamination material comprising a conducting material is disposed between the plurality of micro-OLEDs and the plurality of pixels, and wherein any one pixel in the electronic backplane can couple to a varied subset of micro-OLEDs in the plurality of micro-OLEDs.
2. The method of claim 1 , wherein forming OLED stack comprises:
depositing a hole transport layer;
depositing an organic light emitting material layer; and
depositing an electron injection layer.
3. The method of claim 1 , wherein forming the second electrode layer over the OLED stack comprises vapor deposition of a metal layer over the OLED stack.
4. The method of claim 1 , wherein forming the lamination material comprises incorporating an anisotropic conduction material into a polymeric host material.
5. The method of claim 1 , wherein the portion of the second electrode layer is removed by laser ablation.
6. The method of claim 1 , wherein the patterning is performed by:
cold-welding the portion of the second electrode layer to a patterned die; and
removing the cold-welded portion from the surface of the OLED stack.
7. The method of claim 1 , wherein patterning the second layer of micro OLEDs comprises sealing offset layers in the space between the micro-OLEDS.
8. The method of claim 1 , wherein joining comprises:
applying heat to melt the lamination material; and
applying pressure to join the OLED structure on the first substrate to one side of the lamination material and an active side of an electronic backplane on the second substrate to the opposing side of the lamination material.