Pattern reversal process for self aligned imprint lithography and device

1. A pattern reversal process for self aligned imprint lithography (SAIL) comprising:

providing a flexible substrate;

depositing at least one layer of thin film material upon the substrate;

establishing a pattern upon the layer of thin film material, the pattern providing at least one exposed area and at least one covered area of the thin film layer of material;

treating the at least one exposed area to provide at least one etch resistant area within the thin film material, the covered area of thin film material remaining etch susceptible;

removing the patterned second layer to expose the treated and untreated areas of the at least one layer of thin film material, the etch susceptible area of thin film material laterally adjacent to the etch resistant area of thin film material; and

etching the at least one layer of thin film material to remove the etch susceptible area of material.

2. The method of claim 1 , wherein treating the at least one exposed area provides at least one toughened area of thin film material, the covered area remaining un-toughened.

3. The method of claim 1 , wherein the treating reverses the pattern upon the layer of thin film material.

4. The method of claim 1 , wherein the method is performed as a roll-to-roll process.

5. A pattern reversal process for self aligned imprint lithography (SAIL) comprising:

providing a flexible substrate;

providing a 3D structure upon the flexible substrate, the 3D structure having a plurality of different vertical heights;

depositing at least one layer of thin film material upon the 3D structure;

establishing a pattern upon the layer of thin film material with a patterned second layer, the pattern providing at least one exposed area and at least one covered area of the thin film layer of material;

treating the exposed area of the layer of material to provide at least one etch resistant area of the thin film material, the covered area of the layer of thin film material remaining etch susceptible;

removing the pattern to expose the at least one layer of thin film material, the etch susceptible area of thin film material laterally adjacent to the etch resistant area of thin film material; and

etching the layer of thin film material to remove the etch susceptible area of thin film material.

6. The method of claim 5 , wherein the pattern and the 3D structure are distortion tolerant in maintaining alignment with respect to the exposed area.

7. The method of claim 5 , wherein the pattern is established by depositing a planarization material and removing a portion of the planarization material thereby exposing a portion of the layer of thin film material.

8. The method of claim 5 , wherein treating the at least one exposed area provides at least one toughened area of thin film material, the covered area remaining un-toughened.

9. The method of claim 8 , wherein the toughening is by plasma treatment.

10. The method of claim 8 , wherein the toughening is by photo interaction.

11. The method of claim 8 , wherein the toughening is by electroforming.

12. The method of claim 8 , wherein the toughening is by ion implantation.

13. The method of claim 8 , wherein the toughening reverses the pattern upon the layer of material.

14. The method of claim 5 , wherein the etch resistant properties of the treatment are removed following the etching of etch susceptible areas.

15. The method of claim 5 , wherein the 3D structure is comprised of an imprint polymer.

16. The method of claim 5 , wherein the method is performed as a roll-to-roll process.

17. A method of providing at least one thin-film device comprising:

providing a flexible substrate;

providing a 3D structure upon the flexible substrate, the 3D structure having a plurality of different vertical heights;

depositing at least one layer of thin film device material upon the 3D structure;

establishing a pattern upon the layer of thin film device material with a patterned second layer, the pattern providing at least one exposed area and at least one covered area of the layer of thin film device material;

toughening the exposed area of the layer of thin film device material to provide at least one toughened area of thin film device material, the covered area of the layer of thin film device material remaining un-toughened;

removing the pattern to expose the at least one layer of material, the un-toughened area of material laterally adjacent to the toughened area of material;

etching the layer of thin film device material to remove the un-toughened area of material; and

depositing at least one second thin-film device layer upon the remaining toughened area of thin film device material.

18. The method of claim 17 , wherein the toughening is by plasma treatment, photo interaction, electroforming, ion implantation, and combinations thereof.

19. The method of claim 17 , wherein the toughening properties are removed following the etching of the un-toughened area.

20. The method of claim 17 , wherein the at least one thin-film device is a transistor device, the toughened material providing the gate electrode.

21. The method of claim 17 , wherein the at least one thin-film device is a cross-over device.

22. The method of claim 17 , wherein the method is performed as a roll-to-roll process.

23. The method of claim 17 , wherein establishing the pattern further comprises:

depositing a planarization material upon the layer of thin film device material;

removing a first portion of the planarization material thereby exposing a first portion of the layer of thin film device material;

removing the first portion of the layer of thin film device material; and

removing a second portion of the planarization material thereby exposing a second portion of the layer of thin film device material.

24. The method of claim 17 , further comprising:

depositing a planarization material upon the thin-film device layer;

removing a first portion of the planarization material thereby exposing a first portion of the thin-film device layer;

removing the first portion of the thin-film device layer; and

removing the remaining planarization material.

25. The method of claim 1 , wherein the pattern is distortion tolerant in maintaining alignment with respect to the exposed area.

26. The method of claim 1 , wherein the etch susceptible material is removed from a first height below a second height of the etch resistant material.

27. The method of claim 5 , wherein the etch susceptible material is removed from a vertical height that is below the vertical height of the etch resistant material.

28. The method of claim 17 , wherein the etch susceptible material is removed from a vertical height that is below the vertical height of the etch resistant material.

29. The method of claim 17 , wherein the pattern and the 3D structure are distortion tolerant in maintaining alignment with respect to the exposed area.