Forming a plurality of thin-film devices

1. A method of forming a plurality of thin-film elements comprising:

coarsely patterning at least one thin-film material on a flexible substrate with an additive process; and

forming a plurality of thin-film elements on the flexible substrate with a self-aligned imprint lithography (SAIL) process.

2. The method of claim 1 wherein coarsely patterning at least one thin-film material comprises:

patterning the at least one thin-film material with a subtractive process.

3. The method of claim 1 wherein forming a plurality of thin-film elements on the flexible substrate with a self-aligned imprint lithography (SAIL) process comprises:

depositing at least one material over the flexible substrate;

forming a 3D structure over the at least one material; and

patterning the at least one material in accordance with desired characteristics of the plurality of thin-film elements.

4. The method of claim 1 wherein forming a plurality of thin-film elements on the flexible substrate with a self-aligned imprint lithography (SAIL) process comprises:

depositing a planarization material.

5. The method of claim 1 wherein the plurality of thin-film elements comprises at least one of a via, a diode, an insulated crossover and a memory cell.

6. The method of claim 1 wherein the additive process employs shadow masking techniques to pattern the at least one thin-film material in a coarse fashion.

7. The method of claim 1 wherein the additive process employs inkjet printing to pattern the at least one thin-film material in a coarse fashion.

8. The method of claim 2 wherein the subtractive process employs screen print masks to pattern the at least one thin-film material in a coarse fashion.

9. The method of claim 2 wherein the subtractive process employs roll-to-roll photolithography to pattern the at least one thin-film material in a coarse fashion.

10. The method of claim 3 wherein the 3D structure comprises of a polymer material.

11. The method of claim 3 wherein forming a 3D structure over the at least one material comprises: imprinting a polymer over the at least one material; and forming a 3D pattern in the polymer.

12. The method of claim 3 wherein the 3D structure comprises 4 discrete vertical heights.

13. The method of claim 4 wherein the planarization material comprises at least one of a photo-resist, a UV-curable polymers and a spin-on glass.

14. The method of claim 12 wherein depositing at least one material comprises:

depositing a bottom metal layer on the patterned flexible substrate;

depositing a diode material in contact with the bottom metal layer; and depositing a switch layer.

15. The method of claim 14 further comprising:

removing a first portion of the 3D structure;

applying a first planarizing polymer in contact with the 3D structure;

etching the first planarizing polymer; removing a second portion of the 3D structure;

applying a top metal;

applying a second planarizing polymer;

performing a first etch of the second planarizing polymer thereby exposing a first portion of the top metal;

performing a second etch of the second planarizing polymer thereby exposing a second portion of the top metal;

removing any metal from a sidewall of the second planarizing polymer; and

removing a portion of the second planarizing polymer.

16. The method of claim 15 wherein the first planarizing polymer is capable of being selectively removed with respect to the polymer.

17. The method of claim 15 wherein the first planarizing polymer is the same as the second planarizing polymer.

18. The method of claim 15 further comprising:

forming a PIRM array.