IP Library › Granted Patent US 7,080,596
Granted Patent B2
US 7,080,596 · App. 10/794,928 · Granted Jul 25, 2006

Micro-casted silicon carbide nano-imprinting stamp

Assignee: Hewlett-Packard Development Company, LP.
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Quick Facts
Patent No.
US 7,080,596
App. No.
10/794,928
Granted
Jul 25, 2006
Kind
B2
Abstract

A micro-casted silicon carbide nano-imprinting stamp and method of making a micro-casted silicon carbide nano-imprinting stamp are disclosed. A micro-casting technique is used to form a foundation layer and a plurality of nano-sized features connected with the foundation layer. The foundation layer and the nano-sized features are unitary whole that is made entirely from a material comprising silicon carbide (SiC) which is harder than silicon (Si) alone. As a result, the micro-casted silicon carbide nano-imprinting stamp has a longer service lifetime because it can endure several imprinting cycles without wearing out or breaking. The longer service lifetime makes the micro-casted silicon carbide nano-imprinting stamp economically feasible to manufacture as the manufacturing cost can be recouped over the service lifetime.

Claims (9)

1. A micro-casted silicon carbide nano-imprinting stamp, comprising:

a handling substrate;

a glue layer connected with the handling substrate, wherein the glue layer comprises a material selected from the group consisting of tungsten, titanium, titanium nitride, cobalt, platinum, gold, a gold-tin alloy, silver, and a silicide;

a foundation layer connected with the glue layer and including a base surface; and

a plurality of nano-sized features connected with the foundation layer and extending outward of the base surface, the nano-sized features including an outer surface defining an imprint profile, the foundation layer and the nano-sized features are a micro-casted unitary whole and are made entirely from a material comprising silicon carbide, and

wherein a hardness of the silicon carbide is operative to maintain the imprint profile of the nano-sized features over repeated engagements of the nano-imprinting stamp with a media to be imprinted.

2. The micro-casted silicon carbide nano-imprinting stamp of claim 1 , wherein the handling substrate is made from a material selected from the group consisting of a bare silicon wafer, a polysilicon coated silicon wafer, a silicon oxide coated silicon wafer, and a silicon nitride coated silicon wafer.

3. The micro-casted silicon carbide nano-imprinting stamp of claim 1 , wherein the nano-sized features have a dimension that is less than about 1.0 μm.

4. The micro-casted silicon carbide nano-imprinting stamp of claim 1 , wherein the dimension of the nano-sized features is less than about 100.0 nm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2014
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: APPLIED MATERIALS, INC.
Reel/Frame 033576/0067 →
Continuity (2)
Division 1027964300 · Oct 24, 2002
Related Publication 20040169003A1 · Sep 2, 2004