Non-volatile memory device and method of manufacturing the same
View Patent ↗A non-volatile memory device and method of manufacturing the same is provided. A substrate is provided and then a trench is formed in the substrate. Thereafter, a bottom oxide layer, a charge-trapping layer and a top oxide layer are sequentially formed over the substrate and the surface of the trench. A conductive layer is formed over the top oxide layer filling the trench. The conductive layer is patterned to form a gate over the trench. The top oxide layer, the charge-trapping layer and the bottom oxide layer outside the gate are removed. A source/drain doping process is carried out. Because the non-volatile memory device is manufactured within the trench, storage efficiency of the device is improved through an increase in the coupling ratio. Furthermore, more charges can be stored by increasing the depth of the trench.
1. A non-volatile memory device, comprising:
a substrate, wherein the substrate has a trench;
a gate disposed over and completely filling the trench, wherein a part of the gate is protruded above the substrate;
a plurality of spacers located on the sidewalls of the protruded part of the gate;
a bottom oxide layer disposed between the gate and the trench surface;
a charge-trapping layer disposed between the gate and the bottom oxide layer, wherein the charge-trapping layer is conformal to a bottom surface of the trench and at least one sidewall of the trench;
a top oxide layer disposed between the gate and the charge-trapping layer;
a plurality of lightly doped regions located in the substrate underneath the spacers; and
a plurality of source/drain regions located at both sides of the trench in the substrate.
2. The non-volatile memory device of claim 1 , wherein the gate extends over a portion of the substrate outside the trench.
3. The non-volatile memory device of claim 2 , wherein bottom oxide layer further extends out of the trench and is disposed between the gate and the substrate.
4. The non-volatile memory device of claim 1 , wherein material constituting the spacers comprises silicon nitride.
5. The non-volatile memory device of claim 1 , wherein material constituting the gate comprises polysilicon.
6. The non-volatile memory device of claim 1 , wherein material constituting the charge-trapping layer is selected from the group consisting of a nitride compound, tantalum oxide, titanic strontium and hafnium oxide.
7. The non-volatile memory device of claim 1 , wherein the device further comprises a silicide layer disposed on the gate surface.
8. The non-volatile memory device of claim 7 , wherein material constituting the metal silicide layer is selected from the group consisting of cobalt silicide, titanium silicide, tungsten silicide, molybdenum silicide, platinum silicide and nickel silicide.