Method of forming a seal for a semiconductor device
View Patent ↗In one embodiment, a reflowable layer 51 is deposited over a semiconductor device 10 and reflowed in an environment having a pressure approximately equal to that of atmosphere to form a seal layer 52 . The seal layer 52 seals all openings 43 in the underlying layer of the semiconductor device 10 . Since the reflow is performed at approximately atmospheric pressure a gap 50 which was coupled to the opening 43 is sealed at approximately atmospheric pressure, which is desirable for the semiconductor device 10 to avoid oscillation. The seal layer 52 is also desirable because it prevents particles from entering the gap 50 . In another embodiment, the seal layer 52 is deposited in an environment having a pressure approximately equal to atmospheric pressure to seal the hole 43 without a reflow being performed.
1. A method for forming a semiconductor device comprising:
providing a semiconductor substrate;
forming a layer over the semiconductor substrate, wherein a gap is formed between the semiconductor substrate and the layer;
forming an opening within the layer;
forming an insulating layer over the layer at approximately atmospheric pressure to seal the opening and close the gap off to the environment, wherein forming the insulating layer comprises depositing the insulating layer and annealing the insulating layer at approximately atmospheric pressure;
placing the semiconductor substrate into a vacuum environment before forming the insulating layer;
removing the semiconductor substrate from the vacuum environment after forming the insulating layer, wherein forming the insulating layer further comprises depositing the insulating layer; and
reflowing the insulating layer after removing the semiconductor substrate from the vacuum environment.
2. The method of claim 1 , wherein depositing the insulating layer further comprises depositing the insulating layer at approximately atmospheric pressure.
3. The method of claim 2 , wherein depositing is performed by chemical vapor deposition (CVD).
4. The method of claim 1 , wherein annealing comprises a furnace anneal.
5. The method of claim 1 , wherein annealing comprises a localized anneal.
6. The method of claim 1 , wherein annealing further comprises annealing in a phosphorus atmosphere.
7. The method of claim 1 , wherein annealing comprises using a laser.
8. The method of claim 1 , wherein annealing comprises reflowing the insulating layer.
9. The method of claim 1 , wherein forming the layer over the semiconductor substrate comprises forming a polysilicon layer.
10. The method of claim 1 , wherein forming an insulating layer comprises forming a phosphosilicate glass (PSG).
11. A method for forming a semiconductor device comprising:
providing a semiconductor substrate having a first set of extensions and an anchor;
forming a layer coupled to the anchor and able to move relative to the substrate in at least one direction, wherein the layer has a second set of extensions, wherein the first set of extensions and the second set of extensions are interdigitated and form a set of gaps;
placing the semiconductor substrate in a vacuum;
forming an insulating layer over the set of gaps in the vacuum;
removing the semiconductor substrate from the vacuum; and
annealing the insulating layer to seal the set of gaps after removing the semiconductor substrate from the vacuum.
12. The method of claim 1 , wherein forming the layer over the semiconductor substrate comprises forming a conductive layer.
13. The method of claim 11 , forming the insulating layer further comprises depositing the insulating layer.
14. The method of claim 13 , wherein depositing is performed by chemical vapor deposition (CVD).
15. The method of claim 13 , wherein annealing comprises a furnace anneal.
16. The method of claim 13 , wherein annealing comprises a localized anneal.
17. The method of claim 13 , wherein annealing further comprises annealing in a phosphorus atmosphere.
18. The method of claim 13 , wherein annealing comprises using a laser.
19. The method of claim 13 , wherein annealing comprises reflowing the insulating layer.
20. The method of claim 1 , wherein forming the layer comprises forming a polysilicon layer.