Method of manufacturing a semiconductor device
View Patent ↗The present invention relates to a method of manufacturing a semiconductor device which may stably transfer an electrical signal by forming a plurality of via holes and contact holes to an underlying conductive layer. According to the present invention, even though a contact or via is electrically shorted, it is possible to stably transfer the electrical signal through the other contact hole(s) or via hole(s). The present method includes: forming a first conductive line on a semiconductor substrate; forming an insulating layer on the semiconductor substrate and the first conductive line; forming a plurality of via holes by selectively etching the insulating layer in order to expose the first conductive line; forming a metal barrier on top of the insulating layer and in the via holes; and forming a plug by depositing a conductive layer sufficiently to fill the via holes, and then planarizing the conductive layer to coplanarity with the insulating layer.
1. A method of manufacturing a semiconductor device, comprising:
forming a first conductive line on a semiconductor substrate;
forming an insulating layer on the semiconductor substrate and the first conductive line;
forming a first photoresist pattern on the insulating layer, in order to expose parts of the insulating layer where a plurality of via holes will be formed;
using the first photoresist pattern as an etching mask, etching the parts of the insulating layer where the plurality of via holes will be formed to a certain thickness so as not to expose the first conductive line;
forming a second photoresist pattern on the insulating layer, in order to expose parts of the insulating layer where each via hole will be formed;
using the second photoresist pattern as an etching mask, selectively etching the plurality of via holes in each of said parts of the insulating layer in order to expose the first conductive line;
forming a third photoresist pattern on the insulating layer in order to expose parts of the insulating layer where the trenches will be formed;
using the third photoresist pattern as an etching mask, etching trenches in the insulating layer to a certain thickness;
forming a metal barrier on the insulating layer and in the via holes; and
forming a plug by depositing a conductive layer sufficiently to fill the via holes, and then planarizing the conductive layer until the conductive layer is substantially coplanar with the insulating layer.
2. The method of claim 1 , wherein the first conductive line comprises copper.
3. The method of claim 1 , wherein the conductive layer and the plug comprise copper.
4. The method of claim 3 , wherein forming the plug and depositing the conductive layer comprises depositing a copper seed layer by physical vapor deposition (PVD) and forming a copper bulk layer on the copper seed layer by electroplating.
5. The method of claim 1 , wherein forming the first conductive line comprises sputtering a metal layer, patterning the metal layer using photolithography, and etching the metal layer.
6. The method of claim 1 , wherein each plurality of via holes has a combined width equal to a width of a corresponding insulating layer part.