Patent Assignment
Reel/Frame 017616/0966
Change of Name
Recorded: 2006-05-15
Pages: 20
Assignor
DONGBUANAM SEMICONDUCTOR INC.
Executed: 2006-03-28
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10, DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Properties
(32)
Method for Fabricating Mos Transistors
Method for Forming Short-Channel Transistors
Method of Manufacturing a Semiconductor Device
Cmos Image Sensor and Method for Manufacturing the Same
Patent:
6,849,886 →
Application:
10/746,615 →
Method for Manufacturing a Cmos Image Sensor
Method of Manufacturing a Cmos Image Sensor
Cmos Image Sensor and Method for Manufacturing the Same
Method for Fabricating Nonvolatile Memory Device
Method of Manufacturing Sonos Flash Memory Device
Method and apparatus for manufacturing semiconductor devices
Application:
10/761,500 →
Publication:
US 2005/0028837
Method of Detecting Misalignment of Ion Implantation Area
Semiconductor Device Including Sidewall Floating Gates
Method for Preventing the Formation of a Void in a Bottom Anti-Reflective Coating Filling a via Hole
Apparatus and method for wafer planarization
Application:
11/022,166 →
Publication:
US 2005/0133156
Nonvolatile Memory Device and Methods of Fabricating and Driving the Same
Method of Fabricating Gate Electrode of Semiconductor Device
Method for forming a contact in semiconductor device
Application:
11/026,288 →
Publication:
US 2005/0142886
Method of Fabricating Semiconductor Device Employing Selectivity Poly Deposition
Method for Fabricating Flash Memory Device
Methods of Forming Silicide Layer of Semiconductor Device
Methods of Fabricating Capacitor
Method for Fabricating Semiconductor Device to Minimize Terminal Effect in Ecp Process
Method of Forming an Isolated Line Pattern Using Photolithography
Method for fabricating metal interconnect in semiconductor device
Application:
11/026,916 →
Publication:
US 2005/0142844
Method of Fabricating a Shallow Trench Isolation Structure in a Semiconductor Device
Application:
11/026,917 →
Publication:
US 2005/0142804
Method for Forming Aluminum Interconnect
Method for Fabricating Semiconductor Device Having First and Second Gate Electrodes
Shallow Trench Isolation Structure and Formation Method Thereof
Methods of Fabricating Bipolar Transistor with Emitter and Collector in Separate Device Isolation Trenches
Method for removing color photoresist
Application:
11/027,434 →
Publication:
US 2005/0139242
Methods of Fabricating via Hole and Trench
Method of Manufacturing a Semiconductor Device
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2003
From: PARK, JEONG HO
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014334/0298 →
Assignment of Assignor's Interest
Jul 25, 2003
From: KIM, TAE WOO
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014342/0151 →
Assignment of Assignor's Interest
Dec 3, 2003
From: LEE, JAE SUK; KIM, JI A.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014798/0062 →
Assignment of Assignor's Interest
Dec 23, 2003
From: HAN, CHANG HUN
To: DONGBU ELECTRONICS CO. LTD.
Reel/Frame 014854/0807 →
Assignment of Assignor's Interest
Dec 23, 2003
From: HAN, CHANG HUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014850/0480 →
Assignment of Assignor's Interest
Dec 24, 2003
From: JUNG, MENG AN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014859/0459 →
Assignment of Assignor's Interest
Dec 24, 2003
From: HAN, CHANG HUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014859/0454 →
Assignment of Assignor's Interest
Jan 20, 2004
From: NAM, SANG WOO; LEE, CHEA GAB
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014916/0529 →
Assignment of Assignor's Interest
Jan 26, 2004
From: HAN, CHANG HUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014937/0368 →
Assignment of Assignor's Interest
Jan 27, 2004
From: YOO, SEUNG JONG
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014938/0547 →
Assignment of Assignor's Interest
Oct 7, 2004
From: JUNG, JIN HYO
To: ANAM SEMICONDUCTOR, INC.
Reel/Frame 015890/0530 →
Assignment of Assignor's Interest
Oct 20, 2004
From: CHOI, YONG JUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015921/0266 →
Assignment of Assignor's Interest
Dec 23, 2004
From: KIM, SANG KWON
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016124/0671 →
Assignment of Assignor's Interest
Dec 27, 2004
From: JUNG, JIN HYO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016141/0217 →
Assignment of Assignor's Interest
Dec 28, 2004
From: JUNG, MYUNG JIN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016142/0090 →
Assignment of Assignor's Interest
Dec 30, 2004
From: LEE, KANG HYUN; LEE, DATE GUN; KIM, KEE HO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016139/0499 →
Assignment of Assignor's Interest
Dec 30, 2004
From: CHO, YONG SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016140/0115 →
Translation Certificate
Apr 7, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016026/0756 →
Change of Name
Dec 23, 2005
From: ANAM SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017143/0240 →
Merger
Feb 10, 2006
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017251/0452 →
Assignment of Assignor's Interest
May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest
Feb 23, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041363/0887 →
Assignment of Assignor's Interest
Jun 12, 2017
From: DONGBU HITEK CO. LTD.; DONGBU ELECTRONICS CO., LTD.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 042676/0548 →