IP Library › Assignment 017251/0452
Patent Assignment
Reel/Frame 017251/0452

Merger

Recorded: 2006-02-10 Pages: 10
Assignor
DONGBU ELECTRONICS CO., LTD.
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (8)
Method of Manufacturing a Semiconductor Device
Patent: 6,964,920 →
Application: 10/733,884 →
Publication: US 2004/0121584
Method for Manufacturing a Cmos Image Sensor
Patent: 7,537,999 →
Application: 10/746,702 →
Publication: US 2005/0064665
Method of Manufacturing a Cmos Image Sensor
Patent: 7,094,519 →
Application: 10/746,703 →
Publication: US 2004/0142568
Cmos Image Sensor and Method for Manufacturing the Same
Patent: 7,217,967 →
Application: 10/746,980 →
Publication: US 2005/0064620
Method for Fabricating Nonvolatile Memory Device
Patent: 7,105,455 →
Application: 10/749,843 →
Publication: US 2004/0157395
Method of Manufacturing Sonos Flash Memory Device
Patent: 6,849,514 →
Application: 10/751,190 →
Publication: US 2004/0157434
Vinyl chloride resin composition
Application: 10/751,500 →
Publication: US 2004/0138386
Method of Manufacturing a Semiconductor Device
Patent: 7,074,716 →
Application: 11/195,986 →
Publication: US 2006/0003578
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 3, 2003
From: LEE, JAE SUK; KIM, JI A.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014798/0062 →
Assignment of Assignor's Interest Dec 23, 2003
From: HAN, CHANG HUN
To: DONGBU ELECTRONICS CO. LTD.
Reel/Frame 014854/0807 →
Assignment of Assignor's Interest Dec 24, 2003
From: JUNG, MENG AN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014859/0459 →
Assignment of Assignor's Interest Dec 24, 2003
From: HAN, CHANG HUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014859/0454 →
Assignment of Assignor's Interest Jan 26, 2004
From: HAN, CHANG HUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014937/0368 →
Assignment of Assignor's Interest Jan 27, 2004
From: YOO, SEUNG JONG
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014938/0547 →
Change of Name May 15, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017616/0966 →
Assignment of Assignor's Interest Jun 12, 2017
From: DONGBU HITEK CO. LTD.; DONGBU ELECTRONICS CO., LTD.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 042676/0548 →
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →