Patent Assignment
Reel/Frame 052845/0474
Assignment of Assignor's Interest
Recorded: 2020-06-05
Pages: 5
Assignor
COLUMBA TECHNOLOGIES, INC.
Executed: 2020-02-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Properties
(41)
Methods to Fabricate Semiconductor Devices
Method of Manufacturing a Cmos Image Sensor
Methods for Forming a Device Isolating Barrier and Methods for Forming a Gate Electrode Using the Same
Semiconductor Devices Having Diffusion Barrier Regions and Halo Implant Regions and Methods of Fabricating the Same
Method for Fabricating Semiconductor Device
Semiconductor Device and Fabricating Method Thereof
Sram Devices and Methods of Fabricating the Same
Transistors of Semiconductor Devices and Methods of Fabricating the Same
Mono Gate Memory Device and Fabricating Method Thereof
Semiconductor Devices and Methods of Manufacturing the Same
Semiconductor Devices and Methods of Manufacturing the Same
Method for Manufacturing a Non-Volatile Memory Device
Methods for Forming a P-Type Polysilicon Layer in a Semiconductor Device
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Method for Manufacturing the Same
Method of Fabricating Mos Transistor
Ldmos Transistor
Capacitor of Semiconductor Device and Manufacturing Method Thereof
Method for Manufacturing Semiconductor Device
Method of Manufacturing a Semiconductor Device
Cmos Image Sensors
Semiconductor Device Using Epi-Layer and Method of Forming the Same
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device and Method for Manufacturing the Same
Copper Metal Interconnection with a Local Barrier Metal Layer
Method for Fabricating Semiconductor Device
Method of Forming a Device Isolation Film of a Semiconductor Device
Image Sensor and Method of Fabricating the Same
Lateral Mos Transistor and Method for Manufacturing Thereof
Semiconductor Device and Fabricating Method Thereof
Cmos Image Sensor and Method for Fabricating the Same
High Voltage Semiconductor Device and Method for Manufacturing the Same
Method for Fabricating Lateral Double Diffused Metal Oxide Semiconductor (Ldmos) Transistor
Semiconductor Memory Device, Method of Manufacturing the Same, and Cell Array of Semiconductor Memory Device
Power Management Integrated Circuit
Semiconductor Device and Method for Fabricating the Same
Single Poly Eeprom Having a Tunnel Oxide Layer
Image Sensor and Method for Fabricating the Same
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Package and Method of Forming Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →