MIM capacitor of semiconductor device and manufacturing method thereof

1. A capacitor of a semiconductor device, comprising:

a bottom electrode formed on a substrate, the bottom electrode having an uneven top surface;

an interlayer insulation layer formed on the substrate, the interlayer insulation layer having a via hole exposing the top surface of the bottom electrode;

a dielectric layer formed unevenly on the bottom electrode; and

a top electrode formed on the dielectric layer while filling the via hole, wherein the top electrode includes a conductive plug and a conductive layer that are formed in sequence.

2. The capacitor according to claim 1 , wherein the dielectric layer is formed on the top surface of the bottom electrode and the interlayer insulation layer inside the via hole.

3. The capacitor according to claim 1 , wherein the unevenness of the dielectric layer is formed at a lower portion thereof.

4. The capacitor according to claim 1 , wherein the unevenness of the dielectric layer is formed at lower and upper portions thereof.

5. The capacitor according to claim 1 , further comprising barrier metal layers formed in the bottom surface of the bottom electrode, the bottom surface of the conductive layer, and the bottom electrode of the conductive plug, respectively.

6. The capacitor according to claim 1 , further comprising a conductive plug connected to the bottom electrode in the substrate disposed below the bottom electrode.

7. The capacitor according to claim 1 , further comprising anti-reflection layers formed on the top surfaces of the bottom electrode and the top electrode, respectively.

8. A method of manufacturing a capacitor of a semiconductor device, comprising:

forming a first conductive layer on a substrate;

selectively etching the first conductive layer to form a first interconnection and a bottom electrode with an uneven top surface;

forming an interlayer insulation layer on the substrate where the first interconnection and the bottom electrode are formed;

selectively etching the interlayer insulation layer to form a first via hole exposing a surface of the bottom electrode, and forming a dielectric layer on the bottom electrode;

selectively etching the interlayer insulation layer to form a second via hole exposing a top surface of the first interconnection, and forming a conductive plug and a via plug in the first via hole and the second via hole, respectively;

forming a second conductive layer on the interlayer insulation layer wherein the conductive plug and the via plug are formed; and

selectively etching the second conductive layer to form a second interconnection connecting to the via plug and a conductive layer connecting to the conductive plug.

9. The method according to claim 8 , wherein the forming of the first interconnection and the bottom electrode with the uneven top surface includes:

coating a photoresist on the first conductive layer and patterning the coated photoresist to form a first interconnection pattern and a plurality of bottom electrode patterns disposed in a narrow gap; and

etching the first conductive layer using the first interconnection pattern and the bottom electrode patterns as an etching mask.

10. The method according to claim 8 , wherein the dielectric layer is further formed on the top surface of the bottom electrode and the interlayer insulation layer disposed at an inner side of the first via hole.

11. The method according to claim 8 , further comprising forming a conductive plug connected to the bottom electrode in the substrate below the bottom electrode.

12. The method according to claim 8 , further comprising forming an anti-reflection layer on an entire surface of a resulting structure after the first conductive layer.

13. The method according to claim 8 , further comprising forming an anti-reflection layer on an entire surface of a resulting structure after the second conductive layer is formed.

14. The method according to claim 8 , further comprising forming a barrier metal layer on the substrate before the first conductive layer is formed.

15. The method according to claim 8 , further comprising forming a barrier metal layer on the dielectric layer where the conductive plug is formed.

16. A method of manufacturing a capacitor of a semiconductor device, comprising:

forming a first conductive layer on a substrate;

patterning and etching the first conductive layer to form a first interconnection and a bottom electrode;

forming an interlayer insulation layer on the substrate where the first interconnection and the bottom electrode are formed;

etching the interlayer insulation layer to form a first via hole exposing a predetermined portion of a surface of the bottom electrode;

forming unevenness on a top surface of the bottom electrode;

forming a dielectric layer on the bottom electrode;

selectively etching the interlayer insulation layer to form a second via hole exposing a top surface of the first interconnection, and forming a conductive plug and a via plug in the first via hole and the second via hole, respectively;

forming a second conductive layer on the interlayer insulation layer where the conductive plug and the via plug are formed; and

selectively etching the second conductive layer to form a second interconnection connecting to the via hole and a conductive layer connecting to the conductive plug.

17. The method according to claim 16 , wherein the forming of the unevenness on the top surface of the bottom electrode includes:

coating a photoresist on the top surface of the bottom electrode and patterning the coated photoresist to form a plurality of bottom electrode patterns disposed in a narrow gap; and

shallowly etching the top surface of the bottom electrode using the bottom electrode patterns as an etching mask.

18. The method according to claim 16 , wherein the dielectric layer is further formed on the top surface of the bottom electrode and the interlayer insulation layer disposed at an inner side of the first via hole.

19. The method according to claim 16 , further comprising forming a conductive plug connected to the bottom electrode in the substrate below the bottom electrode.