Patent Assignment
Reel/Frame 014859/0459
Assignment of Assignor's Interest
Recorded: 2003-12-24
Pages: 2
Assignor
JUNG, MENG AN
Executed: 2003-12-23
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10, DAECHI-DONG, KANGNAM-KU,, DONGBU FINANCIAL CENTER, 32ND FLOOR, SEOUL,, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing a Cmos Image Sensor
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Feb 10, 2006
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017251/0452 →
Change of Name
May 15, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017616/0966 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest
Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →