IP Library Granted Patent US 6,903,595
Granted Patent B2
US 6,903,595 · App. 10/736,719 · Granted Jun 7, 2005

High voltage transfer circuit

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,903,595
App. No.
10/736,719
Granted
Jun 7, 2005
Kind
B2
Abstract

Disclosed is a method of the present invention relates to a high voltage transfer circuit. The high voltage transfer circuit includes a first high voltage switch for transferring a high voltage generated within a chip to the outside of the chip according to a clock signal and a first control signal, and a second high voltage switch for transferring the high voltage generated outside the chip to the inside of the chip according to the clock signal and a second control signal. Therefore, it is possible to easily analyze fail of an initial product without manufacturing additional PMOS transistor that withstands a high voltage.

Claims (32)

1. A high voltage transfer circuit located inside a chip, the high voltage transfert circuit comprising:

a first high voltage switch for transferring a high voltage generated within the chip to an outside of the chip according to a clock signal and a first control signal; and

a second high voltage switch for transferring the high voltage generated from the outside of the chip to the inside of the chip according to the clock signal and a second control signal.

2. The high voltage transfer circuit as claimed in claim 1 , wherein the first high voltage switch comprises:

a first switch for transferring the first control signal to a first node;

a second switch for transferring the high voltage generated within the chip to a second node according to a potential of the first node;

a capacitor for controlling a potential of the second node according to the clock signal;

a third switch for transferring the potential of the second node to the first node according to the potential of the second node; and

a fourth switch for transferring the high voltage generated within the chip to the outside of the chip according to the potential of the first node.

3. The high voltage transfer circuit as claimed in claim 1 , wherein the second high voltage switch comprises:

a first switch for transferring the second control signal to a first node;

a second switch for transferring the high voltage generated outside the chip to a second node according to a potential of the first node;

a capacitor for controlling a potential of the second node according to the clock signal;

a third switch for transferring the potential of the second node to the first node according to the potential of the second node; and

a fourth switch for transferring the high voltage generated from the outside of the chip to the inside of the chip according to the potential of the first node.

4. A high voltage transfer circuit, comprising:

a pumping circuit for generating a high voltage necessary for an operation of a flash memory cell, and supplying the high voltage to an internal circuit of the high voltage transfer circuit;

a high voltage pad for receiving the high voltage generated from the pumping circuit, or the high voltage generated from an outside of the high voltage transfer circuit;

a first high voltage switch for transferring the high voltage generated from the pumping circuit to the high voltage pad according to a clock signal and a first control signal in a monitoring mode; and

a second high voltage switch for transferring the high voltage supplied to the high voltage pad from the outside of the high voltage transfer circuit to the internal circuit according to the clock signal and a second control signal in an external voltage supply mode.

5. The high voltage transfer circuit as claimed in claim 4 , wherein the first high voltage switch comprises:

a first NMOS transistor driven by a power supply voltage, for transferring the first control signal to a first node;

a second NMOS transistor for transferring the high voltage generated from the pumping circuit to a second node according to a potential of the first node;

a capacitor for controlling a potential of the second node according to the clock signal;

a third NMOS transistor for transferring the potential of the second node to the first node according to the potential of the second node; and

a fourth NMOS transistor for transferring the high voltage generated from the pumping circuit to the outside of the high voltage transfer circuit according to the potential of the first node.

6. The high voltage transfer circuit as claimed in claim 4 , wherein the second high voltage switch comprises:

a first switch driven by a power supply voltage, for transferring the second control signal to a first node;

a second NMOS transistor for transferring the high voltage generated from the outside of a high voltage transfer circuit to a second node according to the potential of the first node;

a capacitor for controlling a potential of the second node according to the clock signal;

a third NMOS transistor for transferring the potential of the second node to the first node according to the potential of the second node; and

a fourth NMOS transistor for transferring the high voltage generated from the outside of the high voltage transfer circuit to the inside of the high voltage transfer circuit according to the potential of the first node.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2012
From: STMICROELECTRONICS S.R.L.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 029186/0761 →