IP Library Granted Patent US 6,934,186
Granted Patent B2
US 6,934,186 · App. 10/741,804 · Granted Aug 23, 2005

Semiconductor device

Assignee: Innovative Silicon S.A.
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Quick Facts
Patent No.
US 6,934,186
App. No.
10/741,804
Granted
Aug 23, 2005
Kind
B2
Abstract

A semiconductor device, such as a memory device or radiation detector, is disclosed, in which data storage cells are formed on a substrate. Each of the data storage cells includes a field effect transistor having a source, drain, and gate, and a body arranged between the source and drain for storing electrical charge generated in the body. The magnitude of the net electrical charge in the body can be adjusted by input signals applied to the transistor, and the adjustment of the net electrical charge by the input signals can be at least partially cancelled by applying electrical voltage signals between the gate and the drain and between the source and the drain.

Claims (101)

1. A semiconductor memory array comprising:

a plurality of memory cells arranged in a matrix form, the plurality of memory cells include a first memory cell and a second memory cell, wherein the first and second memory cells each consist essentially of a transistor, and wherein each transistor includes:

a source region;

a drain region;

a body region disposed between the source region and the drain region, wherein the body region is electrically floating; and

a gate spaced apart from, and capacitively coupled to, the body region; wherein each memory cell includes:

a first data state representative of a first charge in the body region wherein the first charge is substantially provided by accumulating majority carriers in the body region; and

a second data state representative of a second charge in the body region wherein the second charge is substantially provided by removing majority carriers from the body region; and

wherein the drain region of the transistor of the first memory cell and the drain region of the transistor of the second memory cell share the same region; and

a plurality of bit lines, including a first bit line connected to the drain regions of the transistors of the first and second memory cells.

2. The memory array of claim 1 the plurality of memory cells further includes a third memory cell wherein the third memory cell consists essentially of a transistor, wherein the transistor includes:

a source region;

a drain region;

a body region disposed between the source region and the drain region, wherein the body region is electrically floating; and

a gate spaced apart from, and capacitively coupled to, the body region;

wherein each memory cell includes:

a first data state representative of a first charge in the body region wherein the first charge is substantially provided by accumulating majority carriers in the body region; and

a second data state representative of a second charge in the body region wherein the second charge is substantially provided by removing majority carriers from the body region; and

wherein the source region of the transistor of the second memory cell and the source region of the transistor of the third memory cell share the same region.

3. The memory array of claim 1 further including a control unit, coupled to the gate and the drain region of the transistor of the first memory cell, to provide control signals to the transistor of the first memory cell, wherein the transistor of the first memory cell, in response to a first write control signals, stores the first charge in the body region and wherein the first charge in a portion of the body region that is adjacent to the source region of the transistor of the first memory cell.

4. The memory array of claim 1 further including a control unit, coupled to the gate and the drain region of the transistor of the first memory cell, to provide control signals to the transistor of the first memory cell, wherein the transistor of the first memory cell, in response to first write control signals, stores the first charge in the body region and wherein the first charge in a portion of the body region that is adjacent to the drain region of the transistor of the first memory cell.

5. The memory array of claim 1 further including a control unit, coupled to the gate and the drain region of the transistor of the first memory cell, to provide control signals to the transistor of the first memory cell, wherein the transistor of the first memory cell, in response to a second write control signals, stores the second charge in the body region wherein the second charge is substantially provided by removing majority carriers from the body region through the source region of the transistor of the first memory cell.

6. The memory array of claim 1 further including a control unit, coupled to the gate and the drain region of the transistor of the first memory cell, to provide control signals to the transistor of the first memory cell, wherein the transistor of the first memory cell, in response to a second write control signals stores the second charge in the body region wherein the second charge is substantially provided by removing majority carriers from the body region through the drain region of the transistor of the first memory cell.

7. The memory array of claim 1 further including:

a reading unit, coupled to the first bit line, to determine the data state of the first memory cell;

a control unit, coupled to gate of the transistor of the first memory cell, to provide control signals to the transistor of the first memory cell; and

wherein, in response to a read control signal applied to the gate of the transistor of the first memory cell by the control unit, the reading unit determines the data state of the first memory cell.

8. The memory array of claim 7 wherein the reading unit further determines the data state of the second memory cell and, in response to a read control signal applied to the gate of the transistor of the second memory cell by the control unit, the reading unit determines the data state of the second memory cell.

9. A semiconductor memory array comprising:

a plurality of memory cells arranged in a matrix form, the plurality of memory cells include a first memory cell and a second memory cell, wherein the first and second memory cells each consist essentially of a transistor, and wherein each transistor includes:

a source region having impurities to provide a first conductivity type;

a drain region having impurities to provide the first conductivity type,

a body region disposed between the source region and the drain region wherein the body region is electrically floating and includes impurities to provide a second conductivity type wherein the second conductivity type is different from the first conductivity type;

a gate disposed over the body region;

wherein the memory cell includes:

a first data state representative of a first charge in the body region wherein the first charge is substantially provided by impact ionization; and

a second data state representative of a second charge in the body region wherein the second charge is substantially provided by removing charge from the body region; and

wherein the drain region of the transistor of the first memory cell and the drain region of the transistor of the second memory cell share the same region; and

wherein the memory array further includes a plurality of bit lines, including a first bit line connected to the drain regions of the transistors of the first and second memory cells.

10. The memory array of claim 9 wherein the plurality of memory cells further includes a third memory cell wherein the third memory cell consists essentially of a transistor, wherein the transistor includes:

a source region having impurities to provide the first conductivity type;

a drain region having impurities to provide the first conductivity type,

a body region disposed between the source region and the drain region wherein the body region is electrically floating and includes impurities to provide the second conductivity type;

a gate disposed over the body region;

wherein the memory cell includes:

a first data state representative of a first charge in the body region wherein the first charge is substantially provided by impact ionization; and

a second data state representative of a second charge in the body region wherein the second charge is substantially provided by removing charge from the body region; and

wherein the memory array further includes a plurality of word lines, including a first word line, which is connected to the gate of the transistor of the first memory cell and the gate of the transistor of the third memory cell, and a second word line which is connected to the gate of the transistor of the second memory cell.

11. The memory array of claim 10 further including a control unit, coupled to the gate and drain region of the transistor of the first memory cell, to apply control signals to transistor of the first memory cell wherein the control signals include first write control signals to accumulate the first charge in the body of the transistor of the first memory cell and a second write control signals to provide the second charge in the body region by removing majority carriers from the body region through the source region.

12. The memory array of claim 10 further including a control unit, coupled to the gate and drain region of the transistor of the first memory cell, to apply control signals to the transistor of the first memory cell wherein the control signals include a first write control signals to accumulate the first charge in the body of the transistor of the first memory cell and a second write control signals to provide the second charge in the body region by removing majority carriers from the body region through the drain region.

13. The memory array of claim 10 wherein the transistor of the first memory cell stores at least a substantial portion of the first charge in a portion of the body region of the transistor of the first memory cell that is adjacent to the source region of the transistor of the first memory cell.

14. The memory array of claim 10 wherein the transistor of the first memory cell stores at least a substantial portion of the first charge in a portion of the body region of the transistor of the first memory cell that is adjacent to the drain region of the transistor of the first memory cell.

15. The memory array of claim 10 further including:

a reading unit, coupled to the drain region of the first memory cell, to determine the data state of the first memory cell;

a control unit, coupled to gate of the transistor of the first memory cell via the first word line, to provide control signals to the transistor of the first memory cell; and

wherein, in response to a read control signal applied to the first word line and the drain region of the transistor of the first memory cell by the control unit, the reading unit senses the charge stored in the body region of the transistor of the first memory cell.

16. The memory array of claim 15 wherein the reading unit further determines the data state of the third memory cell and, in response to the read control signal applied to the first word line by the control unit, the reading unit determines the data state of the third memory cell.

17. The memory array of claim 15 wherein the reading unit further determines the data state of the second memory cell and, in response to the read control signal applied to the second word line by the control unit, the reading unit determines the data state of the second memory cell.

18. The memory array of claim 15 wherein:

the reading unit further determines the data state of the second memory cell and, in response to the read control signal applied to the second word line by the control unit, the reading unit determines the data state of the second memory cell; and

wherein the voltage applied to the first word line prevents the state of the transistor of the first memory cell from being determined.

19. A semiconductor memory array, disposed in or on a semiconductor region or layer which resides on or above an insulating region or layer of a substrate, the semiconductor memory array, comprising:

a plurality of memory cells, including a first memory cell and a second memory cell, arranged in a matrix form and disposed in or on the semiconductor region or layer, wherein the first and second memory cells each consist essentially of a transistor, and wherein each transistor includes:

a source region having impurities to provide a first conductivity type;

a drain region having impurities to provide the first conductivity type,

a body region disposed between the source region, the drain region and the insulating region or layer of the substrate, wherein the body region is electrically floating and includes impurities to provide a second conductivity type wherein the second conductivity type is different from the first conductivity type;

a gate spaced apart from, and capacitively coupled to, the body region, wherein the memory cell includes:

a first data state representative of a first charge in the body; and

a second data state representative of a second charge in the body region wherein the second charge is substantially provided by removing charge from the body region; and

wherein the drain region of the transistor of the first memory cell and the drain region of the transistor of the second memory cell share the same region; and

wherein the memory array further includes a plurality of bit lines, including a first bit line connected to the drain regions of the transistors of the first and second memory cells.

20. The memory array of claim 19 wherein the plurality of memory cells further includes a third memory cell wherein the third memory cell consists essentially of a transistor, and wherein the transistor includes:

a source region having impurities to provide the first conductivity type;

a drain region having impurities to provide the first conductivity type.

a body region disposed between the source region, the drain region and the insulating region or layer of the substrate, wherein the body region is electrically floating and includes impurities to provide the second conductivity type;

a gate spaced apart from, and capacitively coupled to, the body region;

wherein the memory cell includes:

a first data state representative of a first charge in the body; and

a second data state representative of a second charge in the body region wherein the second charge is substantially provided by removing charge from the body region; and

wherein the source region of the transistor of the first memory cell and the source region of the transistor of the third memory cell share the same region; and

wherein the memory array further includes a plurality of word lines, including a first word line, which is connected to the gate of the transistor of the first memory cell and the gate of the transistor of the third memory cell, and a second word line which is connected to the gate of the transistor of the second memory cell.

21. The memory array of claim 20 further including a control unit, coupled to the first and second word lines and the first bit line, to control the data state of the transistor of the first memory cell wherein, in response to a first voltage applied to the drain region of the transistor of the first memory cell and a second voltage applied to the gate of the transistor of the first memory cell, the first charge is removed from the body region of the transistor of the first memory cell.

22. The memory array of claim 21 wherein the control unit, in response to removing the first voltage from the drain region of the transistor of the first memory cell before removing the second voltage from the gate of the transistor of the first memory cell, causes the second charge to be stored in the body region of the transistor of the first memory cell.

23. The memory array of claim 21 wherein the control unit, in response to applying ground to the drain region of the transistor of the first memory cell before removing the second voltage from the gate of the transistor of the first memory cell, causes the second charge to be stored in the body region of the transistor of the first memory cell.

24. The memory array of claim 21 wherein the control unit, in response to applying a third voltage to the drain region of the transistor of the first memory cell before applying a fourth voltage to the gate of the transistor of the first memory cell, causes the transistor of the first memory cell to store the second charge in its body region.

25. The memory array of claim 19 wherein the transistor of the first memory cell stores the majority carriers which are representative of the first charge in a portion of its body region that is adjacent to its source region.

26. The memory array of claim 19 wherein the transistor of the first memory cell stores majority carriers which are representative of the first charge in a portion of its body region that is adjacent to its drain region.

27. The memory array of claim 19 further including a control unit, coupled to the first word line and the first bit line, to apply control signals to the transistor of the first memory cell wherein:

in response to a first write control signals, the transistor of the first memory cell generates and stores the first charge in the body region; and

in response to second write control signals, the transistor of the first memory cell generates and stores the second charge in the body region wherein the transistor of the first memory cell generates the second charge by removing majority carriers from its body region through its source region; and

wherein the first and second write control signals include a plurality of signals.

28. The memory array of claim 27 wherein the transistor of the first memory cell stores majority carriers which are representative of the first charge in a portion of the body region of the transistor of the first memory cell that is adjacent to the source region of the transistor of the first memory cell.

29. The memory array of claim 19 further including a control unit, coupled to the first word line and the first bit line, to apply control signals to the transistor of the first memory cell wherein:

in response to first write control signals, the transistor of the first memory cell generates and stores the first charge in the body region; and

in response to a second write control signals, the transistor of the first memory cell generates and stores the second charge in the body region wherein the transistor of the first memory cell generates the second charge by removing charge from its body region through its drain region; and

wherein the first and second write control signals include a plurality of signals.

30. The memory array of claim 29 wherein the transistor of the first memory cell stores the majority carriers which are representative of the first charge in a portion of the body region of the transistor of the first memory cell that is adjacent to the drain region of the transistor of the first memory cell.

31. The memory array of claim 19 including:

a reading unit, coupled to the drain region of the transistor of the first memory cell, to determine the data state of the first memory cell;

a control unit, coupled to gate of the transistor of the first memory cell, to provide control signals to the transistor of the first memory cell; and

wherein, in response to a read control signal applied to the gate of the transistor of the first memory cell by the control unit, the reading unit senses the charge stored in the body region of the transistor of the first memory cell.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2011
From: INNOVATIVE SILICON ISI S.A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025850/0798 →
Priority Claims (4)
EP 01 810 587 · Jun 18, 2001 · regional
EP 02 405 247 · Mar 28, 2002 · regional
EP 02 405 315 · Apr 18, 2002 · regional
EP PCT/EP02/06495 · Jun 5, 2002 · regional
Continuity (2)
Division 1045023800
Related Publication 20040159876A1 · Aug 19, 2004