Method for manufacturing non-volatile memory cells on a semiconductor substrate
View Patent ↗A semiconductor substrate has active areas bounded by portions of an insulating layer. A thin layer of tunnel oxide is formed on the substrate and a first layer of conductive material is then deposited. Non-volatile memory cells are manufactured thereon by defining floating gate regions. The definition of these floating gate regions involves defining the first layer of conductive material in order to form a plurality of alternated stripes above pairs of active areas alternated by active areas lacking stripes. Spacers are then formed in the shelter of the side walls of the alternated stripes. A second layer of conductive material is then deposited together with the first layer of conductive material. The spacers are then selectively removed.
1. A method for manufacturing non-volatile memory cells on a semiconductor substrate, comprising at least the following steps:
forming active areas in said semiconductor substrate, bounded by portions of an insulating layer;
forming a first thin layer of tunnel oxide and depositing a first layer of conductive material on said active areas;
defining a plurality of floating gate regions, wherein the definition of the floating gate regions comprises the steps of:
defining said first layer of conductive material in order to form a plurality of alternated stripes which form first floating gates above pairs of active areas alternated by active areas lacking stripes;
forming spacers in the shelter of the side walls of said alternated stripes,
depositing a second layer of conductive material in order to fill the space between said spacers so as to form second floating gates above the active areas which previously lacked stripes, and
polishing said second layer of conductive material together with said first layer of conductive material and said spacers to the same planar level.
2. The method according to claim 1 , wherein said plurality of alternated stripes is formed by depositing said first layer of conductive material and by defining said first layer of conductive material by means of lithography.
3. The method according to claim 2 , wherein a thin oxide layer is deposited after forming said plurality of alternated stripes.
4. The method according to claim 3 , wherein the formation of said spacers in the shelter of the side walls of the alternated stripes comprises the deposition of a nitride layer which is patterned together with said thin oxide layer and said tunnel oxide layer in order to expose the active areas whereon no alternated stripes are located.
5. The method according to claim 4 , further comprising reconstruction of the tunnel oxide on the exposed active areas by means of formation of a second tunnel oxide layer being thermally grown.
6. A method for manufacturing non-volatile memory cells on a semiconductor substrate, comprising:
forming active areas in said semiconductor substrate, bounded by portions of an insulating layer;
depositing a first thin layer of tunnel oxide and a first layer of conductive material on said active areas; and
defining a plurality of floating gate regions, comprising:
defining a first floating gate from the first layer of conductive material only over pairs of alternated active areas;
defining spacers in the shelter of the side walls of the first floating gate already defined; and
completing the formation of the floating gate regions over the active areas that lacked by depositing a second layer of conductive material defining a second floating gate between the spacers.
7. A semiconductor fabrication method, comprising:
forming a plurality of first polysilicon stripes to define first semiconductor gate structures over first alternating transistor active areas bounded by insulating portions;
forming sidewall spacers for the plurality of first polysilicon stripes; and
forming a plurality of second polysilicon stripes between the sidewall spacers to define second semiconductor gate structures over second alternating transistor active areas.
8. The method according to claim 7 , wherein forming the plurality of first polysilicon stripes comprises:
depositing a first polysilicon layer;
defining the first polysilicon stripes in the first polysilicon layer using a photolithography mask;
etching using the mask to remove the first polysilicon layer but leave the first polysilicon stripes.
9. The method according to claim 7 , wherein forming the plurality of second polysilicon stripes comprises:
depositing a second polysilicon layer that covers the first polysilicon stripes and fills a region between sidewall spacers;
polishing to remove the second polysilicon layer but leave the second polysilicon stripes and spacers wherein the first and second polysilicon stripes and the spacers are at the same planar level.
10. A semiconductor fabrication method, comprising:
forming a plurality of first polysilicon stripes to define first semiconductor gate structures over first alternating transistor active areas;
forming sidewall spacers for the plurality of first polysilicon stripes; and
forming a plurality of second polysilicon stripes between the sidewall spacers to define second semiconductor gate structures over second alternating transistor active areas;
wherein forming sidewall spacers comprises:
depositing a nitride layer; and
patterning the nitride layer to expose the second alternating active areas but leave the nitride layer adjacent sidewalls of the first polysilicon stripes.
11. A method for manufacturing non-volatile memory cells on a semiconductor substrate, comprising the steps of:
forming active areas in said semiconductor substrate, bounded by portions of an insulating layer;
forming a first thin layer of tunnel oxide and depositing a first layer of conductive material on said active areas;
defining a plurality of floating gate regions, wherein the definition of the floating gate regions comprises the steps of:
defining said first layer of conductive material in order to form a plurality of alternated stripes above pairs of active areas alternated by active areas lacking stripes;
depositing a thin oxide layer;
forming spacers in the shelter of the side walls of said alternated stripes, comprising the deposition of a nitride layer which is patterned together with said thin oxide layer and said tunnel oxide layer in order to expose the active areas whereon no alternated stripes are located,
depositing a second layer of conductive material in order to fill the space between said spacers, and
planarizing said second layer of conductive material together with said first layer of conductive material and said spacers.
12. The method according to claim 11 , wherein said plurality of alternated stripes is formed by depositing said first layer of conductive material and by defining said first layer of conductive material by means of lithography.
13. The method according to claim 11 further including selectively removing said spacers.