IP Library Granted Patent US 7,645,673
Granted Patent B1
US 7,645,673 · App. 10/772,029 · Granted Jan 12, 2010

Method for generating a deep N-well pattern for an integrated circuit design

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,645,673
App. No.
10/772,029
Granted
Jan 12, 2010
Kind
B1
Abstract

A method for the design and layout for a patterned deep N-well. A Tile is specified as a fundamental building block for the deep N-well pattern. The tile comprises a first element on a first layer and may comprise a second element on a second layer. A two dimensional region is covered with an array of contiguous tiles, with the elements on each layer connecting with elements of adjacent tiles to form extended shapes. The array may be converted to a collection of sub-arrays through the removal of tiles. The array or collection of sub-arrays may be merged to produce a first layer pattern and second layer pattern. Design rule checks may be applied to verify the pattern. The first layer shapes and second layer shapes may be edited. The first layer shapes and the second layer shapes may then be combined to produce a deep N-well pattern.

Claims (27)

1. A method of generating a deep N-well pattern for an integrated circuit design, said method comprising:

specifying a tile comprising a first layer wherein said first layer comprises a first layer element for a deep N-well pattern;

arranging multiple instances of said tile to create a tile array covering a portion of said integrated circuit design; and

merging said tiles to produce a deep N-well pattern.

2. The method of claim 1 , wherein said tile further comprises a second layer, wherein said second layer comprises a second layer element.

3. The method of claim 2 , wherein said first layer element is identical in shape to said second layer element.

4. The method of claim 3 , wherein said first layer element is disposed rotated with respect to said second layer element.

5. The method of claim 1 , further comprising editing said tile array.

6. The method of claim 2 , further comprising flattening said first layer and said second layer.

7. A method of generating a deep N-well pattern for an integrated circuit design, said method comprising:

specifying a tile comprising a first layer wherein said first layer comprises a first layer element for a deep N-well pattern;

arranging multiple instances of said tile to create a tile array covering a portion of said integrated circuit design; and

merging said multiple instances of said tiles to produce a deep N-well pattern, wherein said deep N-well pattern is operable to provide body-bias voltage connections within said integrated circuit design.

8. The method of claim 7 , wherein said tile further comprises a second layer, wherein said second layer comprises a second layer element.

9. The method of claim 8 , wherein said first layer element is identical in shape to said second layer element.

10. The method of claim 9 , wherein said first layer element is disposed rotated with respect to said second layer element.

11. The method of claim 7 , further comprising editing said tile array.

12. The method of claim 8 , further comprising flattening said first layer and said second layer.

13. A method of generating a deep N-well pattern for an integrated circuit design, said method comprising:

specifying a tile means comprising a first layer wherein said first layer comprises a first layer element for a deep N-well pattern;

arranging multiple instances of said tile means to create a tile array means covering a portion of said integrated circuit design; and

merging said multiple instances of said tile means to produce a deep N-well pattern, wherein said deep N-well pattern is operable to provide body-bias voltage connections within said integrated circuit design.

14. The method of claim 13 , wherein said tile means further comprises a second layer, wherein said second layer comprises a second layer element.

15. The method of claim 14 , wherein said first layer element is identical in shape to said second layer element.

16. The method of claim 15 , wherein said first layer element is disposed rotated with respect to said second layer element.

17. The method of claim 13 , further comprising editing said tile array.

18. The method of claim 14 , further comprising flattening said first layer and said second layer.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 036711 FRAME: 0160. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 6, 2015
From: INTELLECTUAL VENTURES FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036797/0356 →
MERGER Recorded Sep 29, 2015
From: INTELLECTUAL VENTURE FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036711/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2009
From: TRANSMETA LLC
To: INTELLECTUAL VENTURE FUNDING LLC
Reel/Frame 023268/0771 →
MERGER Recorded Mar 26, 2009
From: TRANSMETA CORPORATION
To: TRANSMETA LLC
Reel/Frame 022454/0522 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2004
From: PELHAM, MICHAEL; BURR, JAMES B.
To: TRANSMETA CORPORATION
Reel/Frame 014963/0485 →