IP Library Granted Patent US 6,900,650
Granted Patent B1
US 6,900,650 · App. 10/791,459 · Granted May 31, 2005

System and method for controlling temperature during burn-in

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Quick Facts
Patent No.
US 6,900,650
App. No.
10/791,459
Granted
May 31, 2005
Kind
B1
Abstract

Systems and methods for reducing temperature dissipation during burn-in testing are described. Devices under test are each subject to a body bias voltage. The body bias voltage can be used to control junction temperature (e.g., temperature measured at the device under test). The body bias voltage applied to each device under test can be adjusted device-by-device to achieve essentially the same junction temperature at each device.

Claims (30)

1. An apparatus for burn-in testing comprising:

a device under test adapted to receive a body bias voltage;

a voltage supply for providing said body bias voltage to said device under test; and

a wiring board for coupling said device under test and said voltage supply, wherein said device under test is subject to a burn-in test temperature that is regulated by adjusting said body bias voltage.

2. The apparatus of claim 1 wherein said body bias voltage is selected to achieve a particular test temperature measured at said device under test.

3. The apparatus of claim 1 further comprising a test controller coupled to said device under test via said wiring board.

4. The apparatus of claim 1 further comprising a second voltage supply for providing an operating voltage to said device under test.

5. The apparatus of claim 1 wherein said device under test comprises a positive-channel metal-oxide semiconductor (PMOS) device.

6. The apparatus of claim 5 wherein said body bias voltage is in the range of approximately zero to five volts.

7. The apparatus of claim 1 wherein said device under test comprises a negative-channel metal-oxide semiconductor (NMOS) device.

8. The apparatus of claim 7 wherein said body bias voltage is in the range of approximately zero to minus ten volts.

9. A method of burn-in testing of a device under test, said method comprising:

applying an operating voltage to said device under test;

applying a body bias voltage to said device under test, wherein said body bias voltage is selected to achieve a particular test temperature measured at said device under test; and

measuring temperature at said device under test.

10. The method of claim 9 further comprising adjusting said body bias voltage to adjust temperature at said device under test.

11. The method of claim 9 wherein said device under test comprises a positive-channel metal-oxide semiconductor (PMOS) device.

12. The method of claim 11 wherein said body bias voltage is in the range of approximately zero to five volts.

13. The method of claim 9 wherein said devices under test comprises a negative-channel metal-oxide semiconductor (NMOS) device.

14. The method of claim 13 wherein said body bias voltage is in the range of approximately zero to minus ten volts.

15. An apparatus for burn-in testing comprising:

a plurality of devices under test, each device under test adapted to receive a body bias voltage, wherein the temperature at each device under test is monitored;

a voltage supply for providing body bias voltages applied to said devices under test; and

a wiring board comprising circuitry that individually couples each device under test to said voltage supply such that each device under test can receive a different body bias voltage, wherein a body bias voltage applied to a device under test is selected to achieve a particular test temperature measured at said device under test.

16. The apparatus of claim 15 further comprising a test controller coupled to said device under test via said wiring board.

17. The apparatus of claim 15 further comprising a voltage supply for providing an operating voltage to said devices under test.

18. The apparatus of claim 15 wherein said devices under test comprises positive-channel metal-oxide semiconductor (PMOS) devices.

19. The apparatus of claim 18 wherein said body bias of approximately zero to five volts.

20. The apparatus of claim 18 wherein said devices under test comprises negative-channel metal-oxide semiconductor (NMOS) devices.

21. The apparatus of claim 20 wherein said body bias voltages are in the range of approximately zero to minus ten volts.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 036711 FRAME: 0160. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 6, 2015
From: INTELLECTUAL VENTURES FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036797/0356 →
MERGER Recorded Sep 29, 2015
From: INTELLECTUAL VENTURE FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036711/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2009
From: TRANSMETA LLC
To: INTELLECTUAL VENTURE FUNDING LLC
Reel/Frame 023268/0771 →
MERGER Recorded Mar 26, 2009
From: TRANSMETA CORPORATION
To: TRANSMETA LLC
Reel/Frame 022454/0522 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 015048 FRAME 0562. ASSIGNOR CONFIRMS THE ASSIGNMENT. Recorded May 6, 2005
From: SHENG, ERIC CHIEN-LI
To: TRANSMETA CORPORATION
Reel/Frame 017051/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2004
From: SHENG, ERIC CHEN-LI; HOFFMAN, DAVID; NIVEN, JOHN LAURENCE
To: TRANSMETA CORPORATION
Reel/Frame 015048/0562 →