Method of attaching a die to a substrate
View Patent ↗A semiconductor device 30 includes a base carrier 32 , an adhesive material layer 36 and an integrated circuit die 34 . The base carrier 32 has a top side and a bottom side, the top side having a central area for receiving the die 34 and a peripheral area surrounding the central area. The adhesive material layer 36 is disposed on the top side of the base carrier in an “X” shaped pattern. The “X” shaped pattern includes two bisecting lines. The two bisecting lines extend well beyond the central area and into the peripheral area of the base carrier top surface. The die 34 is attached to the base carrier 32 with the adhesive material layer 36 at the central area. Even after attachment of the die 34 , the adhesive material 36 extends well beyond the die 34 and the central area into the peripheral area.
1. A method of attaching an integrated circuit die to a base carrier comprising the steps of:
dispensing an adhesive material onto a central area of a top surface of the base carrier, wherein the central area is sized to receive the integrated circuit die and the central area is surrounded by a peripheral area; and
attaching a bottom surface of the integrated circuit die to the central area on the top surface of the base carrier with the adhesive material, wherein the adhesive material dispensed onto the top surface of the base carrier extends beyond edges of the die a distance treater than about two times a thickness of the die.
2. The method of attaching an integrated circuit die to a base carrier of claim 1 , wherein the dispensed adhesive material covers substantially the entire top surface of the base carrier.
3. The method of attaching an integrated circuit die to a base carrier of claim 1 , wherein the adhesive material is dispensed onto the base carrier top surface in a predetermined pattern.
4. The method of attaching an integrated circuit die to a base carrier of claim 3 , wherein the predetermined pattern comprises an “X” pattern.
5. The method of attaching an integrated circuit die to a base carrier of claim 3 , wherein the predetermined pattern comprises a six point star pattern.
6. The method of attaching an integrated circuit die to a base carrier of claim 3 , wherein the predetermined pattern comprises an eight point star pattern.