Capacitor with high dielectric constant materials and method of making
A stabilized capacitor using non-oxide electrodes and high dielectric constant oxide dielectric materials and methods of making such capacitors and their incorporation into DRAM cells is provided. A preferred method includes providing a non-oxide electrode, oxidizing an upper surface of the non-oxide electrode, depositing a high dielectric constant oxide dielectric material on the oxidized surface of the non-oxide electrode, and depositing an upper layer electrode on the high dielectric constant oxide dielectric material.
1. A method for forming a capacitor comprising: providing a non-oxide electrode comprising a metal or metal nitride; oxidizing an upper surface of said non-oxide electrode using an O 3 gas plasma; depositing a high dielectric constant oxide dielectric material directly onto the oxidized surface of said non-oxide electrode; and depositing an upper layer electrode on said high dielectric constant oxide dielectric material.
2. A method as claimed in claim 1 wherein the oxidation of said upper surface of said non-oxide electrode is carried out at a temperature in the range of from about 250° to about 700° C.
3. A method as claimed in claim 1 wherein said high dielectric constant oxide dielectric material is selected from the group consisting of Al 2 O 3 , Ta 2 O 5 and Ba x Sr (1−x) TiO 3 .
4. A method as claimed in claim 1 wherein the oxidation of said upper surface of said non-oxide electrode is performed in an oxide dielectric deposition chamber under oxidizing conditions prior to the deposition of said high dielectric constant oxide dielectric material.
5. A method as claimed in claim 1 wherein the oxidation is carried out at a temperature in the range of from about 250° to about 500° C.
6. A method for forming a capacitor comprising: providing a non-oxide electrode comprising a metal or metal nitride, in a deposition chamber oxidizing an upper surface of said non-oxide electrode using an O s gas plasma, in the same deposition chamber depositing a high dielectric constant dielectric material directly onto the oxidized surface of said non-oxide electrode, and depositing an upper layer electrode on said high dielectric constant oxide dielectric material.
7. A method for forming a capacitor comprising: providing a non-oxide electrode comprising a metal or metal nitride, oxidizing an upper surface of said non-oxide electrode using an O 3 gas plasma at a temperature in the range of from about 250° to about 700° C., depositing a high dielectric constant dielectric material directly onto the oxidized surface of said non-oxide electrode, and depositing an upper layer electrode on said high dielectric constant oxide dielectric material.
8. A method of forming a DRAM cell comprising providing a non-oxide electrode comprising a metal or metal nitride, oxidizing an upper surface of said non-oxide electrode using an O3 gas plasma, depositing a layer of a high dielectric constant oxide dielectric material directly onto the oxidized surface of said non-oxide electrode, depositing an upper layer electrode on said layer of said high dielectric constant oxide dielectric material, providing a field effect transistor having a pair of source/drain regions, electrically connecting one of said source/drain regions with said conductive oxide electrode and electrically connecting the other of said source/drain regions with a bit line.
9. A method for forming a capacitor comprising: providing a non-oxide electrode comprising a metal or metal nitride; oxidizing an upper surface of said non-oxide electrode using an O 3 gas plasma at a temperature of about 250° to about 700° C.; depositing a high dielectric constant oxide dielectric material directly onto the oxidized surface of said non-oxide electrode; and depositing an upper layer electrode on said high dielectric constant oxide dielectric material.
10. A method for forming a capacitor comprising: providing a non-oxide electrode comprising a metal or metal nitride; oxidizing an upper surface of said non-oxide electrode using an O 3 gas plasma; depositing a high dielectric constant oxide dielectric material directly onto the oxidized surface of said non-oxide electrode; and depositing an upper layer electrode comprising titanium nitride on said high dielectric constant oxide dielectric material.
11. A method for forming a capacitor comprising: providing a non-oxide electrode comprising tungsten nitride; oxidizing an upper surface of said non-oxide electrode using an O 3 gas plasma; depositing a high dielectric constant oxide dielectric material directly onto the oxidized surface of said non-oxide electrode; and depositing an upper layer electrode on said high dielectric constant oxide dielectric material.