Cleaning system, device and method
View Patent ↗The cleaning device may clean probe elements. The probe elements may be the probe elements of a probe card testing apparatus for testing semiconductor wafers or semiconductor dies on a semiconductor wafer or the probe elements of a handling/testing apparatus for testing the leads of a packaged integrated circuit. During the cleaning of the probe elements, the probe card or the handler/tester is cleaned during the normal operation of the testing machine without removing the probe card from the prober. The cleaning device has a working surface with a particular characteristic (a matte finish or a conductive material) so that a prober is capable of automatically determining the location of the working surface of the cleaning device and therefore operate in an automatic cleaning mode.
1. A method for fabricating a cleaning device whose working surface is capable of being detected by a prober device, the method comprising:
forming a cleaning device having a working surface by forming a first release liner layer, forming a cleaning pad layer having a working surface on the first release liner layer, forming an adhesive layer on the cleaning pad layer, and forming a second release liner layer on the adhesive layer wherein the first release liner layer is removed to create the matte finish of the working surface; and
removing a layer from the working surface wherein the removal of the layer imparts a matte finish to the working surface of the cleaning device.
2. A method for testing semiconductor devices in an automatic cleaning mode, the method comprising:
performing testing of semiconductor devices;
during the testing operation, automatically determining that a cleaning is to be performed;
automatically determining the location of a working surface of a cleaning device based on a characteristic of the working surface by directing optical energy towards the working surface of the cleaning device and determining the location of the working surface of the cleaning device based on the optical energy reflected off of the working surface of the cleaning device;
performing the cleaning using the cleaning device; and
continuing the testing of semiconductor devices.
3. The method of claim 2 , wherein determining the working surface of the cleaning device further comprises measuring the conductance of the working surface of the cleaning device in order to determine the position of the working surface of the cleaning device.
4. The method of claim 2 , wherein performing the cleaning further comprises moving a probe element in a horizontal motion.
5. The method of claim 2 , wherein performing the cleaning further comprises moving a probe element in an orbital motion.
6. A method for testing packaged semiconductor devices, the method comprising:
performing testing of the packaged semiconductor devices;
during the testing operation, automatically determining that a cleaning is to be performed;
automatically determining the location of a working surface of a cleaning device based on a characteristic of the working surface by directing optical energy towards the working surface of the cleaning device and determining the location of the working surface of the cleaning device based on the optical energy reflected off of the working surface of the cleaning device;
performing the cleaning using the cleaning device; and
continuing testing of packaged semiconductor devices.
7. The method of claim 6 , wherein determining that cleaning is to be performed further comprises measuring the parameters of each semiconductor device being tested and initiating a cleaning step when the measured parameters vary from a normal value.
8. The method of claim 6 , wherein determining that cleaning is to be performed further comprises performing a cleaning step after a predetermined number of testing operations.
9. The method of claim 8 , wherein determining the working surface of the cleaning device further comprises measuring the conductance of the working surface of the cleaning device in order to determine the position of the working surface of the cleaning device.
10. The method of claim 8 , wherein performing the cleaning further comprises moving a probe element in a horizontal motion.
11. The method of claim 8 , wherein performing the cleaning further comprises moving a probe element in an orbital motion.