Patent Assignment
Reel/Frame 056104/0979
Security Agreement
Recorded: 2021-04-30
Received: 2021-04-30
Pages: 9
Assignor
INTERNATIONAL TEST SOLUTIONS, LLC
Executed: 2021-04-30
Assignee
JPMORGAN CHASE BANK, N.A.
10 SOUTH DEARBORN STREET, L2, CHICAGO, IL, 60603, UNITED STATES
Covered Properties
(29)
Wafer Manufacturing Cleaning Apparatus, Process And Method Of Use
Application:
16/895,106 →
Device and Method for Thermal Stabilization of Probe Elements Using a Heat Conducting Wafer
Application:
16/872,292 →
System and Method for Cleaning Wire Bonding Machines Using Functionalized Surface Microfeatures
Application:
16/855,841 →
Pick and Place Machine Cleaning System and Method
Application:
16/794,068 →
System and Method for Cleaning Contact Elements and Support Hardware Using Functionalized Surface Microfeatures
Application:
16/684,453 →
Pick and Place Machine Cleaning System and Method
Application:
16/460,918 →
Pick and Place Machine Cleaning System and Method
Application:
16/460,929 →
Pick and Place Machine Cleaning System and Method
Application:
16/460,935 →
Pick and Place Machine Cleaning System and Method
Application:
16/460,877 →
Working Surface Cleaning System and Method
Application:
16/290,789 →
Novel Material and Hardware to Automatically Clean Flexible Electronic Web Rolls
Application:
16/283,592 →
Novel Material and Hardware to Automatically Clean Flexible Electronic Web Rolls
Application:
16/283,603 →
Novel Material and Hardware to Automatically Clean Flexible Electronic Web Rolls
Application:
16/283,613 →
Novel Material and Hardware to Automatically Clean Flexible Electronic Web Rolls
Application:
16/283,607 →
Apparatuses, Device, and Methods for Cleaning Tester Interface Contact Elements and Support Hardware
Application:
16/228,664 →
Wafer Manufacturing Cleaning Apparatus, Process And Method Of Use
Application:
16/136,965 →
Working Surface Cleaning System and Method
Application:
15/818,386 →
Semiconductor Wire Bonding Machine Cleaning Device and Method
Application:
15/723,151 →
Method, Apparatus and Computer Program Product for Assessing the Risk of Electronic Communciations Using Logon Types
Application:
15/581,055 →
Semiconductor Wire Bonding Machine Cleaning Device and Method
Application:
15/495,873 →
Wafer Manufacturing Cleaning Apparatus, Process And Method Of Use
Application:
15/419,840 →
Apparatuses, Device, and Methods for Cleaning Tester Interface Contact Elements and Support Hardware
Application:
14/445,003 →
Wafer Manufacturing Cleaning Apparatus, Process and Method of Use
Application:
13/971,619 →
Working Surface Cleaning System and Method
Application:
13/961,127 →
Wafer Manufacturing Cleaning Apparatus, Process and Method of Use
Application:
13/725,827 →
Apparatuses, Device, and Methods for Cleaning Tester Interface Contact Elements and Support Hardware
Application:
13/290,017 →
Apparatuses, Device, and Methods for Cleaning Tester Interface Contact Elements and Support Hardware
Application:
13/290,015 →
Apparatuses, Device, and Methods for Cleaning Tester Interface Contact Elements and Support Hardware
Application:
12/630,714 →
Cleaning System, Device and Method
Application:
10/825,718 →