Wafer manufacturing cleaning apparatus, process and method of use
A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
1. A semi-conductor manufacturing apparatus cleaning wafer comprising in combination:
(i) a resilient cleaning pad body having a cleaning side with a tacky area; and
(ii) a compressible projection section separate from the tacky area and protruding outwardly from the cleaning side of the cleaning pad body, the projection section urging the wafer away from a surface in the semiconductor manufacturing apparatus when the wafer is pressed against the surface.
2. The cleaning wafer of claim 1 wherein the tacky area is planar.
3. The cleaning wafer of claim 1 wherein the tacky area is shaped to conform to the surface in the semiconductor manufacturing apparatus.
4. The cleaning wafer of claim 1 wherein the tacky area comprises two sub-areas of differing thicknesses.
5. The cleaning wafer of claim 4 wherein at least one of the sub-areas is shaped to conform to a surface in the semiconductor manufacturing apparatus.
6. The cleaning wafer of claim 1 wherein the tacky area comprises two sub-areas of differing levels of tack.
7. The cleaning wafer of claim 6 wherein at least one of the sub-areas is shaped to conform to a surface in the semiconductor manufacturing apparatus.