Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
View Patent ↗A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
1. A test probe cleaning material for cleaning the contact elements and support structures of testing interfaces used for wafer level or package level IC semiconductor device functional testing, the cleaning material comprising:
a cleaning pad layer, one or more intermediate layers underneath the cleaning pad layer and an adhesive layer underneath the one or more intermediate layers;
the one or more intermediate layers supporting the cleaning pad layer and having a set of predetermined characteristics, wherein a modulus of elasticity has a range between more than 40-MPa to 600-MPa, each layer has a thickness between 25-um and 300-um and each layer has a hardness between 30 Shore A and 90 Shore A; and
wherein the one or more intermediate layers further comprises a plurality of abrasive particles having a Mohs Hardness of 7 or greater.
2. The cleaning material of claim 1 , wherein the one or more intermediate layers further comprises one or more compliant layers.
3. The cleaning material of claim 1 , wherein the one or more intermediate layers further comprises one or more rigid layers.
4. The cleaning material of claim 1 , wherein the one or more intermediate layers further comprises at least one rigid layer and at least one compliant layer.
5. The cleaning material of claim 1 , wherein the one or more intermediate layers provide one or more of an abrasiveness, a specific gravity, an elasticity, tackiness, planarity, thickness and a porosity.
6. The cleaning material of claim 5 , wherein the cleaning pad layer provides one or more of an abrasiveness, a specific gravity, an elasticity, tackiness, planarity, thickness and a porosity.
7. The cleaning material of claim 2 , wherein each compliant layer is made of one or more of rubbers, synthetic polymers and natural polymers with a porosity within a range from 10 to 150 micropores per inch.
8. The cleaning material of claim 3 , wherein each rigid layer is made of one or more of rubbers, synthetic polymers and natural polymers with a porosity within a range from 10 to 150 micropores per inch.
9. The cleaning material of claim 1 , wherein the plurality of abrasive particles further comprises one or more kinds of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.
10. The cleaning material of claim 1 , wherein the plurality of abrasive particles further comprises a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.
11. The cleaning material of claim 1 , wherein the plurality of abrasive particles further comprises a blend of one or more particles that each have sizes selected from a size range between 0.05-um and 15-um.
12. The cleaning material of claim 11 , wherein the plurality of abrasive particles further comprises a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.
13. The cleaning material of claim 1 , wherein the plurality of abrasive particles is spatially distributed within the intermediate materials layers.
14. The cleaning material of claim 1 further comprising a sacrificial top protective layer to protect and isolate the cleaning pad layer from contamination.
15. The cleaning material of claim 1 further comprising a removable release liner that is removed to expose the adhesive layer.