Wafer manufacturing cleaning apparatus, process and method of use
A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
1. A semiconductor manufacturing apparatus cleaning system comprising:
a semiconductor manufacturing apparatus having first and second surfaces subject to contamination during operation of the apparatus;
a cleaning wafer comprising a resilient cleaning pad having a cleaning side with a tacky area and a compressible tack-free area protruding above the tacky area; and
an arm adapted to carry the cleaning wafer, the arm movable to position the cleaning wafer adjacent the first surface, force the tacky area against the first surface and thereby compress the tack-free area, and then release, whereby the tack-free area decompresses and urges the cleaning wafer away from the first surface.
2. The system of claim 1 wherein the arm is movable to position the cleaning wafer adjacent the second surface, force the tacky area against the second surface and thereby compress the tack-free area, and then release, whereby the tack-free area decompresses and urges the cleaning wafer away from the second surface.
3. The system of claim 1 wherein the tacky area is shaped to conform to the first surface.
4. The system of claim 1 wherein the tacky area comprises two sub-areas of differing thicknesses.
5. The system of claim 4 wherein at least one of the sub-areas is shaped to conform to the first surface.
6. The system of claim 4 wherein the arm is movable to orient the cleaning wafer to align at least one of the sub-areas with the first surface.
7. The system of claim 1 wherein the tacky area comprises two sub-areas of differing levels of tack.
8. The system of claim 7 wherein at least one of the sub-areas is shaped to conform to the first surface.
9. The system of claim 7 wherein the arm is movable to orient the cleaning wafer to align at least one of the sub-areas with the first surface.
10. The system of claim 1 wherein the first surface is grooved, whereby air can pass through the groove between the first surface and the cleaning wafer while the wafer is being forced against the first surface.
11. The system of claim 1 wherein the tacky area is compliant to deform around the first surface.
12. The system of claim 11 wherein the arm is movable to orient the cleaning wafer to align with the first surface.
13. The system of claim 11 wherein the tacky area comprises at least two sub-areas of differing compliance properties.
14. The system of claim 13 wherein a first one of the sub-areas is shaped to conform to the first surface.
15. The system of claim 13 wherein the arm is movable to orient the cleaning wafer to align the first one of the sub-areas with the first surface.
16. The system of claim 13 wherein a first one of the sub-areas is shaped to conform to a first portion of the first surface and a second one of the sub-areas is shaped to conform to a second portion of the first surface.
17. The system of claim 13 wherein the arm is movable to orient the cleaning wafer to align the first one of the sub-areas with the first portion of the first surface and the second one of the sub-areas with the second portion of the first surface.
18. The system of claim 2 wherein the tacky area comprises at least two sub-areas of differing compliance properties.
19. The system of claim 18 wherein a first one of the sub-areas is shaped to conform to the first surface and a second one of the sub-areas is shaped to conform to the second surface.
20. The system of claim 19 wherein the arm is movable to orient the cleaning wafer to align the first one of the sub-areas with the first surface and the second one of the sub-areas with the second surface.
21. A semiconductor manufacturing apparatus cleaning system comprising:
cleaning means including means for adhering to contaminants on a first surface of the apparatus and means for urging the cleaning means away from the first surface; and
means for urging the cleaning means against the first surface,
whereby contaminants adhere to the cleaning means when the cleaning means is urged against the first surface and are removed from the first surface when the cleaning means is urged away from the first surface.
22. The system of claim 21 wherein the means for adhering is shaped to conform to the first surface.
23. The system of claim 21 wherein the means for adhering comprises two sub-areas of differing tackiness.
24. The system of claim 21 wherein the means for adhering is compliant to deform around the first surface.
25. The system of claim 21 wherein the means for adhering comprises at least two sub-areas of differing compliance properties.
26. The system of claim 25 wherein a first one of the sub-areas is shaped to conform to the first surface and a second one of the sub-areas is shaped to conform to a second surface of the apparatus.
27. The system of claim 21 wherein the cleaning means has an integrated-circuit wafer shape and the means for urging the cleaning means away from the first surface comprises a compressible protrusion extending from a cleaning surface of the cleaning means.