Heat exchange apparatus with parallel flow

1. A heat exchange apparatus comprising:

a) at least one heat exchanger;

b) an intake manifold in fluid communication with each heat exchanger of the at least one heat exchanger, wherein the intake manifold is capable of providing a heat exchange medium separately to each heat exchanger;

c) an exhaust manifold adjacent to the intake manifold, the exhaust manifold being in fluid communication with each heat exchanger of the at least one heat exchanger, wherein the exhaust manifold is capable of receiving the heat exchange medium from each heat exchanger;

d) a plurality of multichip modules mounted to a card, wherein each multichip module of the plurality of multichip modules is positioned between a heat exchanger and the card, such that heat can transfer between each multichip module and a respective heat exchanger;

e) the exhaust manifold and the intake manifold positioned above and adjacent to a side of the card; and

f) the plurality of multichip modules being mounted on the side of the card in a position lateral to the intake manifold and the exhaust manifold.

2. The heat exchange apparatus of claim 1 , wherein the intake manifold is capable of providing the heat exchange medium substantially equally to each heat exchanger.

3. The heat exchange apparatus of claim 1 , wherein each multichip module abuts at least one heat exchanger.

4. The heat exchange apparatus of claim 3 , wherein each multichip module is mounted to at least one heat exchanger.

5. The heat exchange apparatus of claim 3 , wherein each multichip module is compression mounted to at least one heat exchanger.

6. The heat exchange apparatus of claim 3 , wherein each multichip module further comprises a pin electronics die, and wherein the pin electronics die abuts at least one heat exchanger.

7. The heat exchange apparatus of claim 1 , wherein each heat exchanger is a cold plate.

8. The heat exchange apparatus of claim 1 , wherein the heat exchange medium is a liquid.

9. The heat exchange apparatus of claim 4 , wherein the heat exchange medium is an inert liquid.

10. The heat exchange apparatus of claim 1 , further comprising at least one first connector, wherein each first connector of the at least one first connector, is positioned between the intake manifold and each heat exchanger, such that each heat exchanger can be disconnected from the intake manifold.

11. The heat exchange apparatus of claim 1 , further comprising at least one first connector, wherein each first connector of the at least one first connector, is positioned between the intake manifold and each heat exchanger, further comprising at least one second connector, wherein each second connector of the at least one second connector, is positioned between the exhaust manifold and each heat exchanger, such that each heat exchanger can be disconnected from the intake manifold and the exhaust manifold.

12. The heat exchange apparatus of claim 11 , wherein each first connector comprises a quick-release connector, and wherein each second connector comprises a quick-release connector.

13. The heat exchange apparatus of claim 11 , wherein each first connector comprises at least one valve for controlling the flow of the heat exchange medium, and wherein each second connector comprises at least one valve for controlling the flow of the heat exchange medium.

14. The heat exchange apparatus of claim 11 , further comprising a combined manifold structure comprising the intake manifold and the exhaust manifold.

15. The heat exchange apparatus of claim 6 , wherein the pin electronics die is positioned to be cooled by the heat exchange medium prior to cooling other die within the multichip module.

16. In automated test equipment having a printed circuit board, a plurality of multichip modules mounted to the printed circuit board, a coolant source for providing a liquid coolant, a coolant receptor for receiving a liquid coolant, and a liquid cooling apparatus in fluid communication with the coolant source and the coolant receptor, the liquid cooling apparatus comprising:

a) a plurality of cold plates, wherein each cold plate of the plurality of cold plates abuts a multichip module of the plurality of multichip modules, each mulitichip module being positioned between the printed circuit board and the abutting cold plate, such that heat is capable of transferring between the multichip module and the abutting cold plate;

b) an intake manifold positioned above and adjacent to a side of the printed circuit board, wherein the intake manifold is in fluid communication with each cold plate in a parallel configuration, such that the intake manifold is capable of providing coolant to each cold plate separately;

c) an exhaust manifold positioned above and adjacent to a side of the printed circuit board, wherein the exhaust manifold is in direct fluid communication with each cold plate in a parallel configuration, such that the exhaust manifold is capable of receiving coolant from each cold plate separately; and

d) the plurality of multichip modules being positioned lateral to and along a common side of the exhaust manifold, and wherein the plurality of multichip modules are positioned lateral to and along a common side of the intake manifold.

17. The liquid cooling apparatus of claim 16 , further comprising:

a) an intake connector mounted between the coolant source and the intake manifold, wherein the intake connector is capable of separating a fluid connection between the intake manifold and the coolant source, such that the liquid cooling apparatus is separable from the coolant source; and

b) an exhaust connector mounted between the exhaust manifold and the coolant receptor, wherein the exhaust connector is capable of separating a fluid connection between the exhaust manifold and the coolant receptor, such that the liquid cooling apparatus is separable from the coolant source.

18. The liquid cooling apparatus of claim 17 , wherein the intake connector comprises a quick-release connector, and wherein the exhaust connector comprises a quick-release connector.

19. The liquid cooling apparatus of claim 16 , wherein the intake manifold and the exhaust manifold are mounted to the printed circuit board.

20. The liquid cooling apparatus of claim 19 , further comprising a combined manifold structure comprising the intake manifold and the exhaust manifold.

21. The liquid cooling apparatus of claim 17 , further comprising a plurality of inlet cold plate connectors, wherein each inlet cold plate connector of the plurality of inlet cold plate connectors, is positioned between the intake manifold and a cold plate of the plurality of cold plates, a plurality of outlet cold plate connectors, wherein each outlet cold plate connector of the plurality of outlet cold plate connectors, is positioned between the exhaust manifold and a cold plate of the plurality of cold plates, such that each cold plate can be disconnected from the intake manifold and the exhaust manifold.

22. The liquid cooling apparatus of claim 21 , wherein each inlet cold plate connector comprises a quick-release connector, and wherein each outlet cold plate connector comprises a quick-release connector.

23. The liquid cooling apparatus of claim 16 , wherein each multichip module further comprises a pin electronics die, and wherein each pin electronics die abuts at least one cold plate.

24. The liquid cooling apparatus of claim 23 , wherein each pin electronics die abuts at least one cold plate with a thermal paste therebetween.

25. The liquid cooling apparatus of claim 16 , wherein the multichip module comprises at least one pin electronics chip positioned within the multichip module such that the at least one pin electronics chip is cooled prior to cooling other chips within the multichip module.