Semiconductor device and method for manufacturing semiconductor device
View Patent ↗In a method for forming a semiconductor device, the major surface of a substrate is separated into a first element region for forming a first field-effect transistor and a second element region for forming a second field-effect transistor. A silicon nitride film is formed in each of the first and second element regions. Thereafter, the silicon nitride film formed in the second element region is removed, and the substrate is subjected to heat treatment in an ambient that contains nitrogen oxide. Thereby, the silicon nitride film in the first element region is oxidized to form an oxynitride film, and a silicon oxynitride film is formed in the second element region. Thereafter, a high-dielectric-constant film is formed on the silicon oxynitride films in each of the first and second element regions.
1. A semiconductor device comprising;
a substrate,
a first field-effect transistor, including a first gate insulating film and a first gate electrode, on the major surface of said substrate, and
a second field-effect transistor, including a second gate insulating film and a second gate electrode, on the major surface of said substrate, wherein
each of said first gate insulating film and said second gate insulating film includes a silicon oxynitride film and a high-dielectric-constant film,
equivalent-oxide thickness of said first gate insulating film is thicker than equivalent-oxide thickness of said second gate insulating film, and
the high-dielectric-constant film in said first gate insulating film-has the same thickness as the high-dielectric-constant film in said second gate insulating film.
2. The semiconductor device according to claim 1 , wherein the silicon oxynitride film in said first gate insulating film has a higher nitrogen content than the silicon oxynitride film in said second gate insulating film.
3. The semiconductor device according to claim 2 , wherein
the nitrogen content of the silicon oxynitride film in said first gate insulating film is in a range from 10% to 30%, and
the nitrogen content of the silicon oxynitride film in said second gate insulating film does not exceed 10%.
4. The semiconductor device according to claim 1 , wherein the silicon oxynitride films in said first gate insulating film and in said second gate insulating film both have a thickness in a range from about 0.4 nm to 1.0 nm.
5. The semiconductor device according to claim 1 , further comprising a third field-effect transistor including a third gate insulating film and a third gate electrode, wherein
said third gate insulating film includes a silicon oxide film and a high-dielectric-constant film, and
equivalent-oxide thickness of said third gate insulating film is thicker than the equivalent-oxide thickness of said first gate insulating film and said second gate insulating film.
6. The semiconductor device according to claim 5 , wherein the silicon oxynitride film in said first gate insulating film has a nitrogen content higher than the nitrogen content of the silicon oxynitride film in said second gate insulating film.
7. The semiconductor device according to claim 6 , wherein
the nitrogen content of the silicon oxynitride film in said first gate insulating film is in a range from 10% to 30%, and
the nitrogen content of the silicon oxynitride film in said second gate insulating film does not exceed 10%.
8. The semiconductor device according to claim 5 , wherein the silicon oxynitride films in said first gate insulating film and in said second gate insulating film both have a thickness in a range from about 0.4 nm to 1.0 nm.
9. A method for manufacturing a semiconductor device comprising:
separating a major surface of a substrate into a first element region for forming a first field-effect transistor and a second element region for forming a second field-effect transistor,
forming a silicon nitride film on said first element region and on said second element region,
removing said silicon nitride film formed on said second element region,
heat-treating said substrate in an ambient containing nitrogen oxide to oxidize said silicon nitride film formed on said first element region to form an oxynitride film, and to form a silicon oxynitride film on said second element region, and
forming a high-dielectric-constant film on the silicon oxynitride film on both of said first element region and said second element region.
10. The method for manufacturing a semiconductor device according to claim 9 , including heat-treating in a nitrogen monoxide ambient.
11. The method for manufacturing a semiconductor device according to claim 9 , including heat-treating in an ambient of a mixture of dinitrogen oxide and hydrogen.
12. The method for manufacturing a semiconductor device according to claim 9 , including separating the major surface of the substrate to include a third element region for forming a third field-effect transistor; and
before forming said silicon nitride film, forming a silicon oxide film in each of said first, second, and third element regions, and removing the silicon oxide film formed in each of said first and second element regions.
13. The method for manufacturing a semiconductor device according to claim 12 , including heat-treating in an ambient of nitrogen monoxide.
14. The method for manufacturing a semiconductor device according to claim 12 , including heat-treating in an ambient of a mixture of dinitrogen oxide and hydrogen.