Method of assembling a semiconductor component and apparatus therefor
View Patent ↗A method of assembling a semiconductor component includes providing a pedestal, placing a first piece on the curved pedestal, wherein the first piece comprises a semiconductor die, placing a second piece over the first piece, and providing an adhesive between the first piece and the second piece. The method further includes applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece, and applying heat with a second plate to reflow the adhesive, wherein applying heat is performed simultaneously with applying pressure.
1. A method of assembling a semiconductor component, the method comprising:
providing a curved pedestal, wherein the curved pedestal has a concave portion;
placing a first piece on the concave portion of the curved pedestal, wherein the first piece comprises a semiconductor die;
placing a second piece over the first piece;
providing an adhesive between the first piece and the second piece;
applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece; and
applying heat with a second plate to reflow the adhesive, wherein applying heat is performed simultaneously with applying pressure.
2. The method of claim 1 , further comprising:
aligning the first piece to the second piece with alignment features, wherein the alignment features are part of the plate.
3. The method of claim 1 , further comprising:
aligning the first piece to the second piece with alignment features, wherein the alignment features are part of the first piece.
4. The method of claim 1 , wherein providing a curved pedestal comprises:
providing a first curved pedestal;
placing a first piece on the curved pedestal, wherein the first piece comprises a first semiconductor die;
placing a second piece over the first piece;
providing an adhesive between the first piece and the second piece;
applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece; and
applying heat with a second plate to reflow the adhesive and form a test semiconductor component, wherein applying heat is performed simultaneously with applying pressure;
measuring the topography of the test semiconductor component,
comparing the topography of the test semiconductor component to a predetermined topography; and
choosing a second curved pedestal, wherein the second curved pedestal has a different curvature than the first curved pedestal; and
providing the second curved pedestal.
5. The method of claim 4 , wherein
placing a first piece on the curved pedestal further comprises placing a first piece, wherein the first piece further comprises a flange;
placing a second piece over the first piece further comprises placing a second piece, wherein the second piece comprises an insulator;
providing an adhesive further comprises providing an adhesive, wherein the adhesive further comprises a solder perform.
6. The method of claim 1 , wherein placing a second piece over the first piece further comprises placing a second piece, wherein the second piece further comprises leads.
7. The method of claim 1 , wherein
applying pressure with a first plate further comprises applying pressure from the top of the second piece; and
applying heat with a second plate further comprises applying heat from the bottom of the first piece.
8. The method of claim 1 , further comprising placing a third piece over the first piece, wherein the third piece comprises leads.
9. A method of forming a semiconductor component, the method comprising:
providing a heat plate with a cavity;
placing a curved pedestal in the cavity;
placing a flange comprising a semiconductor die on the curved pedestal;
placing solder on the flange;
placing a window frame over the solder;
moving an alignment header down and in contact with the window frame and the flange,
wherein the alignment header comprises alignment features that secure alignment of the flange to the window frame;
applying pressure with the alignment header to the first window frame and the flange;
applying heat with the heat plate to reflow the solder to couple the flange, solder and window frame.
10. The method of claim 9 , wherein placing the window frame over the solder comprises placing the window frame, wherein the window frame comprises leads.
11. The method of claim 9 , wherein
applying pressure further comprises applying pressure from the top of the window frame; and
applying heat further comprises applying heat from the bottom of the flange.
12. The method of claim 9 , wherein providing a curved pedestal comprises:
providing a first curved pedestal;
placing a first piece on the curved pedestal, wherein the first piece comprises a first semiconductor die;
placing a second piece over the first piece;
providing an adhesive between the first piece and the second piece;
applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece; and
applying heat with a second plate to reflow the adhesive and form a test semiconductor component, wherein applying heat is performed simultaneously with applying pressure;
measuring the topography of the test semiconductor component;
comparing the topography of the test semiconductor component to a predetermined topography; and
choosing a second curved pedestal, wherein the second curved pedestal has a different curvature than the first curved pedestal; and
providing the second curved pedestal.