Method for forming self-aligned dual salicide in CMOS technologies
View Patent ↗A method of fabricating a complementary metal oxide semiconductor (CMOS) device, wherein the method comprises forming a first well region in a semiconductor substrate for accommodation of a first type semiconductor device; forming a second well region in the semiconductor substrate for accommodation of a second type semiconductor device; shielding the first type semiconductor device with a mask; depositing a first metal layer over the second type semiconductor device; performing a first salicide formation on the second type semiconductor device; removing the mask; depositing a second metal layer over the first and second type semiconductor devices; and performing a second salicide formation on the first type semiconductor device. The method requires only one pattern level and it eliminates pattern overlay as it also simplifies the processes to form different silicide material over different devices.
1. A method of fabricating a complementary metal oxide semiconductor (CMOS) device, said method comprising:
forming a fire well region in a semiconductor substrate for accommodation of a first type semiconductor device;
forming a second well region in said semiconductor substrate for accommodation of a second type semiconductor device;
shielding said first type semiconductor device with a mask;
depositing a first metal layer over said second type semiconductor device;
performing a first salicide formation on said second type semiconductor device;
removing said mask;
depositing a second metal layer over the first and second type semiconductor devices;
performing a second salicide formation on said first type semiconductor device; and
removing said second metal layer from said second type semiconductor device.
2. The method of claim 1 , wherein said first well region is configured as a NFET (N-type field effect transistor) well region and said second well region is configured as a PFET (P-type field effect transistor) well region.
3. The method of claim 1 , wherein said first well region is configured as a PFET (P-type field effect transistor) well region and said second well region is configured as a NFET (N-type field effect transistor) well region.
4. A method of fabricating a complementary metal oxide semiconductor (CMOS) device, said method comprising:
forming a first well region in a semiconductor substrate for accommodation of a first type semiconductor device;
forming a second well region in said semiconductor substrate for accommodation of a second type semiconductor device;
shielding said first type semiconductor device with a mask;
depositing a first metal layer over said second type semiconductor device;
performing a first salicide formation on said second type semiconductor device;
removing said mask;
depositing a second metal layer over the first and second type semiconductor devices; and
performing a second salicide formation on said first type semiconductor device,
wherein said first metal layer is formed of different materials than said second metal layer.
5. The method of claim 1 , wherein said first type semiconductor device is formed by:
configuring an insulator layer over said first well region;
configuring a gate region over said insulator layer;
forming insulative spacers on opposite sides of said gate region; and
implanting source/drain regions in said first well region.
6. The method of claim 1 , wherein said second type semiconductor device is formed by:
configuring an insulator layer over said second well region;
configuring a gate region over said insulator layer;
forming insulative spacers on opposite sides of said gate region; and
implanting source/drain regions in said second well region.
7. The method of claim 1 , further comprising forming a cap layer over each of said first metal layer and said second metal layer.
8. A method of fabricating a complementary metal oxide semiconductor (CMOS) device, said method comprising:
forming a first well region in a semiconductor substrate for accommodation of a first type semiconductor device;
forming a second well region in said semiconductor substrate for accommodation of a second type semiconductor device;
shielding said first type semiconductor device with a mask;
depositing a first metal layer over said second type semiconductor device;
performing a first salicide formation on said second type semiconductor device;
removing said mask;
depositing a second metal layer over the first and second type semiconductor devices;
forming a cap layer over each of said first metal layer and said second metal layer; and
performing a second salicide formation on said first type semiconductor device,
wherein said cap layer comprises any of TIN, Ti, and TaN.
9. The method of claim 1 , wherein said first metal layer and said second metal layer comprises any of Ti, Co, Ni, Pt, Re, W, Pd, Ta, Nb, and their alloys.
10. A method of forming an integrated circuit on a semiconductor substrate, said method comprising:
forming each of a first and second type semiconductor device on said semiconductor substrate;
depositing a first metal layer over said second type semiconductor device;
performing a first salicide formation on only said second type semiconductor device;
depositing a second metal layer over both said first and second type semiconductor device; and
performing a second salicide formation on only said first type semiconductor device.
11. The method of claim 10 , further comprising shielding said first type semiconductor device with a mask prior to deposition of said first metal layer.
12. The method of claim 11 , further comprising removing said mask after performing said first salicide formation.
13. The method of claim 10 , further comprising removing said second metal layer from said second type semiconductor device.
14. The method of claim 10 , wherein said first metal layer is formed of different materials than said second metal layer.
15. The method of claim 10 , wherein said first type semiconductor device is formed by:
configuring an insulator layer over a first well region;
configuring a gate region over said insulator layer;
forming insulative spacers on opposite sides of said gate region; and
implanting source/drain regions in said well region.
16. The method of claim 15 , wherein said first well region is configured as any of a NFET (N-type field effect transistor) well region and a PFET (P-type field effect transistor) well region.
17. The method of claim 10 wherein said second type semiconductor device is formed by:
configuring an insulator layer over a second well region;
configuring a gate region over said insulator layer;
forming insulative spacers on opposite sides of said gate region; and
implanting extension and source/drain regions in said second well region.
18. The method of claim 17 , wherein said second well region is configured as any of a NFET (N-type field effect transistor) well region and a PFET (P-type field effect transistor) well region.
19. The method of claim 10 , further comprising forming a cap layer over each of said first metal layer and said second metal layer.
20. The method of claim 19 , wherein said cap layer comprises any of TiN, Ti, and TaN.
21. The method of claim 10 , wherein said first metal layer and second metal layer comprises any of Ti, Co, Ni, Pt, Re, W, Pd, Ta, Nb, and their alloys.