PSM alignment method and device

1. A method of aligning a spatial light modulator (SLM) to write a second layer of a pattern over a first layer of a pattern on a workpiece, wherein the workpiece includes at least one coarse alignment mark and the workpiece is supported by a stage that includes at least one reference mark, the method including:

illuminating the coarse alignment mark with radiation relayed from the SLM;

detecting the coarse alignment mark using a camera;

detecting the reference mark; and

calculating the alignment of the workpiece and the SLM using at least information from detecting the reference mark and the coarse alignment mark.

2. The method according to claim 1 , wherein calculating the alignment includes calculating at least translation and rotation parameters.

3. The method according to claim 1 , wherein detecting the at least one coarse alignment mark includes detecting a plurality of the coarse alignment marks.

4. The method according to claim 1 , wherein the detecting the coarse alignment mark further includes fitting a wavelet to an intensity distribution of the coarse alignment mark.

5. The method according to claim 1 , wherein the workpiece further includes at least one fine alignment mark, the method further including:

illuminating the fine alignment mark with radiation relayed from the SLM; and

detecting the fine alignment mark using the camera;

wherein calculating the alignment of the workpiece and the SLM further includes using information from detecting the fine alignment mark.

6. The method according to claim 5 , wherein calculating the alignment includes calculating at least translation and rotation parameters of the alignment.

7. The method according to claim 5 , wherein detecting the at least one fine alignment mark includes detecting a plurality of the fine alignment marks.

8. The method according to claim 5 , wherein the detecting the fine alignment mark further includes fitting a wavelet to an intensity distribution of the coarse alignment mark.

9. The method according to claim 1 , further including aligning the SLM with the camera.

10. The method according to claim 1 , wherein the camera is a CCD camera.

11. The method according to claim 1 , where the at least one coarse alignment mark includes a horizontal and a vertical grid superimposed, where the horizontal and vertical grid have increasing pitches.

12. The method according to claim 11 , wherein the pitch is linearly increasing in at least one of the horizontal and vertical directions.

13. The method according to claim 11 , wherein the pitch is exponentially increasing in at least one of the horizontal or vertical directions.

14. The method according to claim 11 , wherein the pitch is logarithmically increasing in at least one of the horizontal or vertical directions.

15. The method according to claim 11 , wherein the pitch increases from the center towards the edges of the coarse alignment mark.

16. The method according to claim 11 , wherein the pitch increases from the edges towards the center of the coarse alignment mark.

17. The method according to claim 1 , further including:

capturing an image of a reference area of the workpiece by the camera,

subtracting the image of the reference area from an image of the at least one coarse alignment mark on the workpiece when determining a position of the at least one coarse alignment mark on the workpiece.

18. The method according to claim 5 , further including:

capturing an image of a reference area of the workpiece by the camera,

subtracting the image of the reference area from an image of the at least one fine alignment mark on the workpiece when determining a position of the at least one fine alignment mark on the workpiece.

19. The method according to claim 1 , further including:

relaying an alignment image from the SLM onto a section of the workpiece, detecting the projected alignment image with the CCD camera and aligning the CCD camera by using information of the detected projected alignment image.

20. The method according to claim 1 , further including:

pre exposing a resist covering the at least one alignment mark before detecting the alignment mark using the camera.

21. The method according to claim 9 , wherein the SLM projects an alignment mark onto the workpiece that is detected by the camera.

22. The method according to claim 21 , wherein the camera is a CCD and the projected alignment mark is detected in the same region of the CCD as the coarse alignment marks.

23. The method according to claim 21 , wherein the workpiece further includes at least one fine alignment mark, the method further including:

illuminating the fine alignment mark with radiation relayed from the SLM; and

detecting the fine alignment mark using the camera;

wherein calculating the alignment of the workpiece and the SLM further includes using information from detecting the fine alignment mark; and

wherein the camera is a CCD and the projected alignment mark is detected in the same region of the CCD as the fine alignment marks.

24. The method according to claim 1 , wherein an intensity distribution of a detected image of the at least one alignment mark on the workpiece is derived.

25. The method according to claim 24 , wherein a first derivative of the intensity distribution of the detected image is derived and detecting the coarse alignment mark uses the first derivative.

26. A method of producing a phase shifted mask or reticle, according to claim 1 , further including

exposing a layer of radiation sensitive material on the workpiece after a first patterning of the workpiece; and

patterning phase shifting structures on the workpiece using the exposed layer.

27. A method of producing precise structures on a second workpiece according to claim 26 , wherein the workpiece of claim 26 is a mask or reticle, further including:

exposing a layer of radiation sensitive material on the second workpiece using the mask or reticle; and

patterning a layer of a device structure on the second workpiece using the exposed layer on the second workpiece.

28. An alignment mark for use in lithography including a horizontal and a vertical grid superimposed, where the horizontal and vertical grids have increasing pitches.