IP Library Granted Patent US 7,202,759
Granted Patent B2
US 7,202,759 · App. 10/912,726 · Granted Apr 10, 2007

Wideband temperature-variable attenuator

Assignee: Smith Interconnect Microwave Components, Inc.
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Quick Facts
Patent No.
US 7,202,759
App. No.
10/912,726
Granted
Apr 10, 2007
Kind
B2
Abstract

An absorptive temperature-variable microwave attenuator is produced using a first plurality of shunt resistors separated by quarter-wave transmission lines connected by a series resistor with a second plurality of shunt resistors separated by quarter-wave transmission lines. At least one or more of the resistors are temperature-variable resistors. The temperature coefficients of the temperature-variable resistors are selected so that the attenuator changes at a controlled rate with changes in temperature while attenuator remains relatively matched to the transmission line. In one embodiment, the resistors are thick-film resistors and a variety of temperature coefficients can be created for each resistor by properly selecting and mixing different inks when forming the thick film resistors. Furthermore, attenuators can be created having either a negative temperature coefficient of attenuation or a positive temperature coefficient of attenuation.

Claims (25)

1. A temperature-dependent radio-frequency attenuator, comprising:

a first temperature-dependent resistor having a first terminal provided to a first end of a first transmission line section and a second terminal provided to a first end of a second transmission line section;

a second temperature-dependent resistor having a first terminal provided to a second end of said first transmission line section and a second terminal provided to ground;

a third temperature-dependent resistor having a first terminal provided to said first end of said first transmission line section and a second terminal provided to ground;

a fourth temperature-dependent resistor having a first terminal provided to said first end of said second transmission line section and a second terminal provided to ground;

a fifth temperature-dependent resistor having a first terminal provided to a second end of said second transmission line section and a second terminal provided to ground, wherein at least one of said first, second, third, fourth, and fifth temperature-dependent resistors has a first temperature coefficient configured such that said attenuator changes attenuation at a controlled rate with respect to changes in temperature;

a third transmission line section, wherein a first end of said third transmission line section is provided to said second end of said second transmission line section, and wherein a first terminal of a sixth temperature-dependent resistor is provided to a second end of said third transmission line section and a second terminal is provided to ground; and

wherein a characteristic impedance of said third transmission line section is different from a characteristic impedance of said second transmission line section.

2. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said first temperature coefficient comprises a negative temperature coefficient of resistance.

3. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said first temperature coefficient comprises a positive temperature coefficient of resistance.

4. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said first temperature coefficient comprises a positive temperature coefficient of resistance and at least one of said first, second, third, fourth, and fifth temperature-dependent resistors has a negative temperature coefficient of resistance.

5. The temperature-dependent radio-frequency attenuator of claim 1 , wherein at least one of said first, second, third, fourth, and fifth temperature-dependent resistors comprises thick-film resistors.

6. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said first temperature-dependent resistor comprises a printed ink resistor.

7. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said attenuator has a negative temperature coefficient of attenuation.

8. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said attenuator has a positive temperature coefficient of attenuation.

9. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said first transmission line section comprises a microstrip transmission line.

10. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said first transmission line section comprises a stripline transmission line.

11. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said transmission line comprises a co-planar waveguide transmission line.

12. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said transmission line comprises a grounded co-planer waveguide transmission line.

13. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said transmission line comprises a coaxial transmission line.

14. The temperature-dependent radio-frequency attenuator of claim 1 , wherein a VSWR remains below 3 to 1 over a desired frequency band.

15. The temperature-dependent radio-frequency attenuator of claim 1 , further comprising an input transmission line provided to said first transmission line section.

16. The temperature-dependent radio-frequency attenuator of claim 1 , wherein a resistance of said second temperature-dependent resistor is approximately equal to a resistance of said fifth temperature-dependent resistor.

17. The temperature-dependent radio-frequency attenuator of claim 1 , wherein a resistance of said third temperature-dependent resistor is approximately equal to a resistance of said fourth temperature-dependent resistor.

18. The temperature-dependent radio-frequency attenuator of claim 1 , wherein said attenuator is symmetric.

Assignments (3)
MERGER Recorded Mar 25, 2019
From: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
To: INTERCONNECT DEVICES, INC.
Reel/Frame 048682/0201 →
CHANGE OF NAME Recorded Mar 25, 2019
From: INTERCONNECT DEVICES, INC.
To: SMITHS INTERCONNECT AMERICAS, INC.
Reel/Frame 048682/0212 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2005
From: FLORIDA RF LABS, INC.
To: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
Reel/Frame 016535/0448 →
Continuity (1)
Related Publication 20060028289A1 · Feb 9, 2006